DISCO Corporation

		Details

[Feb. 2, 2010]		Introducing the Ultrasonic Dicing Technology, Effective for the Processing of SiC for Power Semiconductors
[Jan. 22, 2010]		DISCO adds pandemic diseases to its list of possible threats Surveillance audit for "BS25999-2:2007", the Standard for BCMS is conducted
[Jan. 8, 2010]		DISCO achieved a five star rating from VLSI Research Inc's Customer Satisfaction Survey
[Jan. 7, 2010]		Will be displayed at SEMICON Korea 2010 has been added.
		Will be displayed at 11th IC PACKAGING TECHNOLOGY EXPO has been added.
[Dec. 25, 2009]		New year's breaks at DISCO offices
		Results of 2009 DISCO Customer Satisfaction Survey has been updated.

		Details

[Feb. 8, 2010]		Consolidated Financial Results for the Third Quarter of Fiscal Year 2009
		Notification of Revision to the Business Forecasts (Fiscal Year 2009)
		Fact Book
[Jan. 21, 2010]		Preliminary Report on Consolidated Sales Figures and Non-Consolidated Earnings Results (Third Quarter of Fiscal Year 2009)
[Jan. 5, 2010]		Preliminary Report on Non-Consolidated Sales Figures (Third Quarter of Fiscal Year 2009)
[Nov. 30, 2009]		Presentation for FY2009 1H Financial Results and FY2009 Forecast