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Bringing science to comfortable living through advanced Kiru, Kezuru, Migaku technologies.
Kiru: Cutting, Kezuru: Grinding, Migaku: Polishing
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Kiru, Kezuru, Migaku Topics
Stealth Dicing Application
Blade Dicing
Laser Dicing
Cutting using a water jet saw
Grinding
Stress Relief
DBG + DAF Laser Cut
DBG
Others
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Dicing New!
Applications Support
Grinding
Dicing and Grinding Service
Polishing
 
DBG
 
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Precision Machines  
Dicing and Cutting Saws
Laser Saws
Grinders
Polishers and Dry Etchers
Surface Planer
Products for New Processes
Precision Processing Tools  
Dicing Blades
Grinding Wheels
Dry Polishing Wheels
Other Products  
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[May 16, 2008]
Concerning the earthquake which occurred in the Sichuan province China on May 12 (update)
[May 13, 2008]
Fact Book has been added.
[May 12, 2008]
Earthquake in Sichuan, China
Financial Report for the Year Ended March 31, 2008
69th Ordinary General Meeting of Shareholders
Revision to the Dividend Policy and Notification about the Year-end Dividend
[May 7, 2008]
Will be displayed at SEMICON Russia 2008 has been added.
[April 22, 2008]
Preliminary Report on Non-Consolidated Earnings Results and Consolidated Sales Figures (Fourth Quarter of Fiscal Year 2007)
 
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