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没有对应的中文网页时,请参阅英语网页。 一覧 Kiru（切）・Kezuru（削）・Migaku（磨）特集 平整机的说明 New! 刀片切割 激光切割 隐形切割应用技术 研削 应力消除 利用喷水切割机进行切割 DBG 其他 应用技术事例集   解决方案支持服务 切割 New! 演示加工试验服务 研削 Dicing and Grinding Service 抛光   DBG   一覧 精密加工设备   切割机·切断机 激光切割机 研削机 抛光干式蚀刻机 平整机 适用于新工艺的产品 精密加工工具   切割用磨轮刀片 研削磨轮 干式抛光磨轮 其他产品   外围设备 相关产品 产品目录（PDF文件）   可以下载迪思科公司产品目录（PDF文件） 迪思科公司產品目錄一覽 Adobe Reader * 打开PDF文件，需使用 Training Services Design Change Notification Inspection Sheet Search To Achieve a Better Process Condition After-Sales Service Equipment Recycling Service Non-use of Restricted Substances Certificate Issuance System 全球服务网		一覧 IR [July 1, 2008] Preliminary Report on Non-Consolidated Sales Figures (First Quarter of Fiscal Year 2008) [June 24, 2008] Our support for the victims of the earthquake in Iwate and Miyagi prefectures, Japan [June 19, 2008] DISCO Increases Investment for Construction of New Building at Chino Plant (Nagano Prefecture) [June 16, 2008] Announcement concerning the earthquake in Japan on June 14 [June 5, 2008] Will be displayed at SEMICON West 2008 has been added. [June 2, 2008] Notice on the 69th Ordinary General Meeting of Shareholders

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