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 IR News |
| December 25, 2002 |
Company Information |
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"Environmental
Report 2002" has been added. |
| November 25, 2002 |
Press Releases |
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DISCO
Announces A New Automatic Dicing Saw |
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DISCO
Announces A New Automatic Grinder |
| October 24, 2002 |
Press Releases |
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DISCO
Announces A New In-feed Surface Grinder for 300-mm Wafers |
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Press Releases |
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DISCO
Announces A New Dry Polisher for 300-mm Wafers |
| September 30, 2002 |
Products |
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"Safety Sheet on How to
Handle Hub Blade" has been added. |
| September 27, 2002 |
Press Releases |
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DISCO to
Issue Share Acquisition Rights for the Purpose of Granting Stock Options |
| August 6, 2002 |
Press Releases |
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DISCO Announces
New 300 mm Fully Automatic Laser Saw Development |
| August 5, 2002 |
Press Releases |
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The specifications for the DFD6340
(200mm fully automatic dicer) and the DFP8140 (200mm
fully automatic dry polisher) have been added. |
| August 2, 2002 |
Company Information |
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DISCO Hiroshima Works Environmental Policy has been revised. |
| July 29, 2002 |
Company Information |
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DISCO Training Center moved. |
| May 30, 2002 |
Press Releases |
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DISCO to
Issue Share Acquisition Rights for the Purpose of Granting Stock Options |
| May 28, 2002 |
Company Information |
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In Honor
of DISCO Head Office Energy Conservation Efforts, the Grand Prize has been awarded. |
| March 13, 2002 |
Company Information |
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DISCO Corporation
Receives Intel's Prestigious Supplier Continuous Quality Improvement (SCQI) Award |
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