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News Releases


2005 2004 2003 2002 2001
IR News
December 27, 2005 Will be displayed at 7th IC PACKAGING TECHNOLOGY EXPO has been added.
December 26, 2005 New year's breaks at DISCO offices
December 7, 2005 Photos from SEMICON Japan 2005 are available
November 28, 2005 Development of the TAIKO process, a new process method for wafer backgrinding
November 21, 2005 Development of a new laser application to enable the effective combination of DBG wafer and DAF for thin chip production
  Development of auto-blade changer that carries out fully automatic dicing blade replacement work
  Commercialization of "StayClean" additive that prevents contamination of adhesion
November 9, 2005 Information on DISCO Booth at SEMICON Japan 2005
November 4, 2005 Amount to Be Paid Upon Exercise of Share Acquisition Rights
October 31, 2005 Our support for the victims of the earthquake in Pakistan(Final report)
October 26, 2005 DISCO to Issue Share Acquisition Rights for the Purpose of Granting Stock Options
October 14, 2005 Our support for the victims of the earthquake in Pakistan
October 11, 2005 Will be displayed at Productronica 2005 has been added.
October 5, 2005 Our support for the victims of Hurricane Katrina in the United States
October 3, 2005 "Discontinued Machines List" has been updated.
September 7, 2005 Separation of DAStec Incorporation from DISCO Corporation
September 5, 2005 Impact of Typhoon No.14, on September 5, 2005
August 29, 2005 Development of a New Stress Relief Process using Dry Etching
August 16, 2005 This announcement is regarding the earthquake in Japan on August 16
August 12, 2005 "Discontinued Machines List" has been updated.
August 10, 2005 Will be displayed at SEMI Expo CIS 2005 has been added.
  "Applications Example" has been added.
July 27, 2005 Will be displayed at SEMICON Taiwan 2005 has been added.
July 23, 2005 On July 23, 2005, magnitude-6.0 earthquake struck northern Chiba neighboring Tokyo
July 21, 2005 DISCO to Issue Compensation-type Stock Options (Share Acquisition Rights)
July 8, 2005 DISCO awarded second customer satisfaction rating among Assembly equipment suppliers by VLSI research survey
June 21, 2005 DISCO TECHNOLOGY (SHANGHAI) CO., LTD. receives ISO 9001 certification.
June 2, 2005 We started disclosing information on the application improvement, showing the most appropriate conditions for the processing.
May 30, 2005 Will be displayed at SEMICON West 2005 has been added.
May 26, 2005 DISCO to Issue Compensation-type Stock Option (Share Acquisition Rights)
  DISCO to Issue Stock Options (Share Acquisition Rights)
May 18, 2005 DISCO is proud to announce the formation of DISCO TECHNOLOGY (SHANGHAI) CO., LTD. Suzhou Office and Chengdu Office.
April 27, 2005 Notification:DISCO Corporation (Japan) will be closed for the Japanese seasonal holiday from April 29 to May 8 (Japan Time).
April 25, 2005 DISCO Develops New Dicing Saw Spindle with Ultrasonic Technology
April 8, 2005 DISCO product catalogs in Chinese are available for download in PDF format.
April 4, 2005 Will be displayed at SEMICON Singapore 2005 has been added.
April 1, 2005 The Notification of Starting for Inspection Sheet Search for B1A, P1A and A1A/K1A series dicing blades.
March 18, 2005 DISCO Corporation receives Intel's prestigious Supplier Continuous Quality Improvement award
March 2, 2005 Will be displayed at SEMICON Europa 2005 has been added.
March 1, 2005 "Discontinued Machines List" has been added.
February 7, 2005 Will be displayed at SEMICON China 2005 has been added.
Will be presented at the SEMI-ECS 2005 International Semiconductor Technology Conference (ISTC).
January 7, 2005 Help those affected by South Asia's earthquake and tsunami.
January 1, 2005 Results of 2004 DISCO Customer Satisfaction Survey has been added.


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