This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
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We will provide you with the best solutions for narrow street products and ultrathin wafers.
DISCO will introduce several technologies using actual machines and samples, such as our new model laser saw with stealth dicing technology and its processed samples, and the TAIKO process suitable for ultrathin grinding. |
Consultation for the Dicing & Grinding Service, which is suitable for small-lot production or R&D, is available.
TECNISCO, as a DISCO affiliate company will participate in partnership, exhibiting precision parts and a Si boat. |
| Precision Machines |
200mm (or 300mm) Semi Automatic Wafer
Mounting System
RAD-2500m/8 (Lintec) |
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| Precision Processing Tools |
| Dicing Blades |
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・ZHZZ series
(Ultrathin hub blades that realize 10 µm kerf)
・ZHCR series
(An expanded lineup of resin bond blades for cutting hard, brittle materials)
・Other blades
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| Dry Polishing Wheel |
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・DP08 |
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| Attention |
Customers who plan to visit DISCO's booth, please complete the attendee registration on the SEMICON Europa website by October 3.
If you attend the exhibition without registering and do not have an entrance ticket, you will be charged 25 Euros <+VAT19%>.
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| Contact |
Your comments and questions are welcome.
Please click here to contact us.
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