DISCO offers customers complete solutions in the technologies of Dicing, Grinding and Polishing for materials like Silicon, SiC, GaAs, Sapphire, etc. Consultation for the technical information is available including our unique process of Dicing Before Grinding (DBG), TAIKO grinding for backside metallization applications, laser process for various materials, line up of dicing blade, grinding wheel and Lintec tape.
We also offer a chargeable processing service, which is ideal for small-lot production or Research & Development.
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