| LED process solutions |
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DISCO will introduce the new process which reduces the processing steps of sapphire substrates. |
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| Laser Technology |
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DISCO will exhibit a wide range of developed laser applications (stealth dicing, grooving, full cut, etc) with actual processed samples. |
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| Wafer Thinning |
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DISCO will introduce a grinder/polisher/mounter in-line system, grinding wheels and the variety of stress relief, which realizes stable processing of thin wafers. |
| Precision Machines |
Fully Automatic Laser Saw
 DFL7340
Automatic Grinder
DAG810
Megcon ACD2000
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| Precision Processing Tools |
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| Contact |
Your comments and questions are welcome.
Please click here to contact us.
For more information, please refer to the SEMICON Singapore 2010 Website.
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