DISCO develops edge trimming process for ultra-thin wafers
DISCO Corporation (Tokyo; Hitoshi Mizorogi, President) has developed a fully automatic edge trimming dicer for 200 mm wafers. Panels regarding this process can be viewed at DISCO's booth at SEMICON Japan 2003 (December 3 - 5; Makuhari Messe, Hall 4, Booth A902).
Background of development
Demand for ultra-thin wafers continues to grow: cellular phones, PDAs, laptop PCs, RFID tags, and many other products increasingly require and smaller and thinner wafer and package technologies, including SiP (System in Package) and stacked devices.
Back-grinding wafers to 100 ｵm or less tends to create a sharp edge, which is prone to chipping that can lead to wafer-level breakage and reduced yield. The edge trimming process, by trimming the edge before grinding, results in a straight edge after grinding that shows greater stability in later processes.
Outline of process
DISCO's edge trimming-dedicated half-cut dicer locates the wafer center with extreme precision and neatly trims the edge. This dicer is capable of processing 300 mm wafers, and a 300 mm version is currently under development. The edge trimming process is excellent in combination with stress relief via dry polishing, with wafer support systems, and with other systems that support process quality and protect wafer yield.
Edge trimming process
 |
Benefits of edge trimming
Schedule
| 12/2003 |
Panel exhibit at SEMICON Japan 2003; first demonstrations. First shipments TBA. |
|
|
|
