DISCO to introduce Fully Automatic Dicing Saw DFD6240 for 200 mm wafers
DISCO Corporation (Tokyo; Hitoshi Mizorogi, President) will be producing and marketing Fully Automatic Dicing Saw DFD6240, a machine designed to dice, cut, and groove semiconductors and electronic parts. DFD6240 can be viewed at DISCO's booth at SEMICON Japan 2003 (December 3 - 5; Makuhari Messe, Hall 4, Booth A902).
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| DFD6240 |
Background of development
The popularity of dicing saws for dicing, cutting, and grooving semiconductors and electronic parts continues to increase. At the same time, customers also expect reduced costs and increased processing quality. To respond these needs, DISCO has developed DFD6240 as a successor to DFD641, a dicer with a record of success at installations around the world.
Outline of DFD6240
DFD6240 comes standard with many new features that increase usability, productivity, and process quality: touch panel LCD with graphical user interface (GUI), cutting water flow rate controller, and condition monitor with spindle amperage display. Further, DFD6240's lineup of optional high-output spindles allows it to handle an extremely wide range of materials. DFD6240 uses less air and electricity for reduced running cost and environmental impact, and its footprint is 20% smaller than that of DFD641.
Sales forecast
Sales for the first year are expected to be 3.0 billion yen.
Schedule
| 12/2003 |
Exhibit at SEMICON Japan 2003. |
| 03/2004 |
First orders accepted; first demonstrations at DISCO Head Office. |
| 06/2004 |
First shipment of products. |
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