DISCO to introduce Fully Automatic Grinder/Polisher DGP8760 and
Fully Automatic Multifunction Mounter DFM2700
DISCO Corporation (Tokyo; Hitoshi Mizorogi, President) will produce and market Fully Automatic Grinder/Polisher DGP8760 for the processing of 200 mm and 300 mm wafers to thicknesses of 50 ｵm or less. DISCO will also market under the DISCO brand Fully Automatic Multifunction Mounter DFM2700, a machine to be produced by Lintec Corporation (Tokyo; Kyohei Tanaka, President). The two machines are designed for in-line configuration. DGP8760 can be viewed at DISCO's booth at SEMICON Japan 2003 (December 3 - 5; Makuhari Messe, Hall 4, Booth A902).
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| DGP8760 |
DGP8760 and DFM2700 in-line system |
Background of development
Demand for ultra-thin wafers continues to grow: cellular phones, PDAs, laptop PCs, RFID tags, and many other products increasingly require smaller and thinner wafer and package technologies, including SiP (System in Package) and stacked devices. Applications involving 50 ｵm or thinner wafers are no longer a rarity.
Demand for 300 mm wafers is also increasing, and the number of 300 mm fabs is expected to grow in 2004. To respond to these needs, DISCO has combined grinding and polishing in 300 mm-capable DGP8760. This machine is configurable in-line with DFM2700, which among other functions supports Lintec Corporation's DAF lamination. (Die attach film, or DAF, is a thin film that replaces epoxy-based adhesives and other technologies. It is typically laminated to the wafer before dicing.)
Outline of DGP8760
DGP8760 employs a three-spindle, four-chuck-table configuration to combine back grinding and stress relief into one complete system. Through a compact design that includes the vacuum unit in the machine cabinet, DGP8760 has reduced footprint by 36% (compared to DFG8560 and DFP8160 combined). Stress relief options include dry polishing and high-mesh grinding.
Outline of DFM2700
DFM2700 is a multipurpose unit capable of the following functions: UV irradiation of protective tape, DAF lamination, mounting of wafers on dicing frames, and peeling of protective tape. DFM2700 features an extremely small footprint and, in combination with DGP8760, forms the world's smallest in-line system for grinding, stress relief, and post-grinding tape functions.
Sales forecast
First year sales for the in-line system are expected to be 5.0 billion yen.
Schedule
| 12/2003 |
Exhibit of DGP8760 and concept launch of DFM2700 at SEMICON Japan 2003. |
| 04/2004 |
First orders accepted; first demonstrations at DISCO Head Office. |
| 09/2004 |
First shipment of products. |
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