DISCO introduces Automatic Dicing Saws DAD3220, DAD3230, and DAD3430 for 6" wafers and Fully Automatic Dicing Saw DFD6450 for 8" wafers
DISCO Corporation (headquarters: Ota-ku, Tokyo; president: Hitoshi Mizorogi) announces the introduction
of new dicing saws for use in the semiconductor, electronic component, and optical component industries: Automatic
Dicing Saws DAD3220, DAD3230, and DAD3430 and Fully Automatic Dicing Saw DFD6450. The machines will be featured products
in DISCO's exhibit at SEMICON Japan 2004, to be held December 1 - 3 (Hall 4, Booth A1101).
Background of development
Dicing saws are essential equipment in the semiconductor, electronic component, and optical component industries. Aiming to get the latest and most advanced devices to market, companies in these industries in turn demand of their suppliers cutting-edge technology, high process quality, and low cost.
DAD3220/DAD3230/DAD3430
The new 3000 Series single-spindle automatic dicing saws for 6" workpieces build on the DAD300 and
DAD500 Series’ record of success at installations around the world. DAD3220, designed for semiconductor wafer dicing,
is based on DAD321, while DAD3230, designed to process glass, ceramics, and other electronic component materials, follows
in the footsteps of DAD522. To satisfy the increased demand for saws that cut and groove optical components and other workpieces
requiring ultra-high precision, DISCO is introducing DAD3430. Each model includes as standard an auto-alignment function,
which improves productivity while reducing operator fatigue.
DFD6450
Featuring parallel dual-spindles, Fully Automatic Dicing Saw DFD6450 is the successor to DFD651, an extensively used dicer by premier manufacturers around the globe. DFD6450's parallel dual-spindle design allows for package singulation with multiple blades on each spindle and many other specialized applications.
Features of each machine
DAD3220
Designed for compactness, DAD3220 preserves the 500 mm width of predecessor DAD321 while reducing total footprint by approximately 14%. The result is conservation of valuable space in cleanrooms and other fabrication environments.
DAD3230
With a focus on performance, DAD3230 features an expandable design that is easily customized, thereby making it able to accommodate a wide range of specialized applications.
DAD3430
DAD3430 features an air slide on the X-axis for even greater precision and process quality. It is an excellent choice for processing optical components and other workpieces requiring ultra-high precision.
DFD6450
By means of its parallel dual-spindles, DFD6450 can cut one workpiece quickly with two identical blades (dual cutting) or use a different blade on each spindle for step cuts, bevel cuts, and other specialized applications. It also features a coolant water flow rate controller that is programmable for each device data. High-load spindles are optionally available for gang-blade singulation of CSP, QFN, and other packages.
In addition, the above models all include an LCD touch panel with a Graphical User Interface for easy and intuitive operation and programming.
Current launch schedule
DAD3220/DAD3230/DAD3430
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Dec. 2004 |
Machines exhibited at SEMICON Japan 2004 (Dec. 1 - 3). |
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Feb. 2005 |
Orders accepted; demo at DISCO HQ initiated. |
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March 2005 |
First units shipped. |
DFD6450
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Dec. 2004 |
Machine exhibited at SEMICON Japan 2004 (Dec. 1 - 3). |
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June 2005 |
Orders accepted; demo at DISCO HQ initiated. |
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Aug. 2005 |
First units shipped. |
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Contact:
DISCO Corporation
Corporate Strategy Division
Management Strategy Department
Marketing Communications Team
Phone: 81-3-4590-1090Fax: 81-3-4590-1094 |
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