DISCO introduces new ZH05, Z05 Series blades for advanced dicing, BT100 bond for rough grinding wheels and Poligrind wheels for ultra-thin grinding
DISCO Corporation (headquarters: Ota-ku, Tokyo; president: Hitoshi Mizorogi) announces the introduction
of new precision abrasives for use in the semiconductor, electronic component, and optical component industries. The
new blades and grinding wheels will be featured products in DISCO's exhibit at SEMICON Japan 2004, to be held December 1 - 3 (Hall 4, Booth A1101).
Background of development
As the market for cellular phones, digital cameras, and other advanced electronics continues to grow, so also has demand expanded for smaller and thinner semiconductor device packages and the machines that create them. In response to the need for even greater precision and process quality in dicing and grinding. DISCO has developed several new precision abrasive products.
Features of each product
ZH05 Series
The ZH05 Series, an extension of the extremely popular ZH Series, has the following features:
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New grit concentration control technology allows for five distinct concentration levels. These
five levels support a superior balance between blade life and improved process quality (in particular, reduced backside
chipping). |
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By strengthening the abrasive portion of the blade, wavy cutting and blade breakage are further
reduced (as compared to previous blades). |
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The ZH05 Series also includes the special features of the ZH01 series, including shortened
precut times and lower chance of blade breakage due to flying die. |
Z05 Series
The Z05 Series, an extension of the popular Z Series, offers the following two types of blade:
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In contrast to previous blades, which offered 2 concentration levels, the first type of Z05
blade offers up to 5 concentration levels in a range that is both wider (includes lower levels than previously offered)
and more finely divided. As a result, such process quality problems as backside chipping in hard and brittle materials
have become easier to improve or solve completely. |
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The second type of Z05 blade offers enhanced process quality by preventing narrowing at the
blade edge and , uneven blade wear. The result is an improved ability to maintain die and package dimensions and
to solve such process quality issues as metal and plastic burrs on plastic circuit boards. |
Poligrind
The Poligrind wheels are a new DISCO technology which, by means of extremely fine abrasive grit, hold to a minimum the grinding damage layer produced in the grinding process.
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Poligrind wheels are fully compatible with standard processes and equipment. By simply using
Poligrind as the fine-grinding wheel in the grinding process, manufacturers can reduce the grinding damage layer
and improve the overall strength of finished die. |
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Because Poligrind is used within the grinding process, it can help improve such stress relief
yield issues as reduced electrical function in certain devices. |
BT100 bond
BT100, a newly available bond for the GF01 Series grinding wheels, has the following two features:
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Compared to standard vitrified bond, newly developed BT100 is a resin bond that greatly improves
process quality (in particular, edge chipping). |
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At the same time, BT100 supports wheel life comparable to that of standard vitrified bond wheels. |
Current launch schedule
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Dec. 2004 |
Above products exhibited at SEMICON Japan 2004 (Dec. 1 - 3) |
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Dec. 2004 |
Sample orders accepted. |
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Contact:
DISCO Corporation
Corporate Strategy Division
Management Strategy Department
Marketing Communications Team
Phone: 81-3-4590-1090Fax: 81-3-4590-1094 |
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