Commercialization of the "StayClean" additive
that prevents adhesion of contamination
DISCO Corporation (Headquarters: Ota-ku, Tokyo, President: Hitoshi Mizorogi) has developed and commercialized an additive that prevents the adhesion of particle contamination, which occurs during dicing. The additive will be exhibited at SEMICON Japan 2005, which will be held from December 7 to 9 (Booth No: 4, Hall: A1009).
Development Background
To improve the product quality of the imaging part of image sensors, which are used in digital cameras, and bonding pads in various types of semiconductor devices, lowering the particle contamination during dicing has become an issue. In addition, MEMS devices, which have minute and fragile structures, tend to be inadequately cleaned due to the water pressure restrictions and similarly residual contamination has become an issue. Particle contamination is a quantity of cutting powder that corresponds to the removed volume of cut material, which has occurred during dicing and remained on the workpiece surface.
Generally, these particles, once they have attached themselves to the workpiece, if they do not move, tend to be difficult to remove completely by cleaning. Therefore, DISCO has focused attention on controlling the adhesion itself and not the removal of the affixed particle.
By adding the StayClean additive, which can control particle adhesion, to the cutting water, particle reduction contributes to a process quality improvement of the devices mentioned above.
DISCO has already developed several varieties of StayClean, based on workpiece type, and is currently evaluating them. On this occasion, DISCO is commercializing one variety called StayClean-F, for effective results with inorganic materials, such as silicon, glass and aluminum film.
|
Product Summary
"StayClean-F" additive for dicing cutting water - Patent Pending
For "StayClean-F," the solution ingredient directly acts against the cutting powder, controls the contact of the cutting power itself and the workpiece and prevents adhesion of the particle contamination. As a result, contamination adhesion is suppressed and it becomes possible to reduce the residual.
- Targeted workpiece
| - |
Bonding pad area such as on semiconductor devices |
|
*In addition to particle contamination prevention, it has been confirmed that StayClean-F is effective in preventing corrosion of the pad. |
| - |
MEMS device elements such as accelerometer and pressure sensor |
- StayClean Features
| - |
No foaming: Prevents discharge water facility and machine trouble due to foaming. |
| - |
Low concentration: It realizes low running costs because it is diluted 1000-10000 times. |
| - |
Basic properties: Transparent and colorless, pH6.1, and does not include
hormone-disrupting chemicals or specific chemical substances. |
| - |
Usage: Using an injector unit, which has been newly developed for dicing saws. |
| |
(with concentration monitoring function and automatic bottle changeover function) |
Contamination improvement comparison - before cleaning (comparison with aluminum film)
| Normal processing when using pure water |
When using StayClean-F |
 |
 |
| *The white areas are cut scraps (mainly silicon) that remained. Since this is before cleaning, nearly the entire surface is contaminated. |
*Even though the wafer has not been cleaned, on a visual level, cutting scrap residue can not be seen. As a result, it is confirmed that StayClean-F has an adhesion prevention effect on cutting scraps during dicing. (The photo shows the reflection of the microscope due to the mirror condition.) |
Contamination adhesion improvement comparison - Gold pad area
| Normal processing when using pure water |
When using StayClean-F |
 |
 |
| Cutting scraps |
Similar to the before dicing condition, cutting scrap adhesion can not be seen. |
Future Plan
| 2005/12 |
|
Exhibit at SEMICON Japan 2005, December 7-9 |
| 2005/12 |
|
Sales start |
Test cut requests, using StayClean-F, are accepted at any time. Also, the development of a test liquid for a StayClean product that prevents the adhesion of resin scraps and a StayClean product that can support CCD/CMOS image sensors has been completed and is in the evaluation stage. On confirmation of data regarding their reliability, DISCO plans to commercialize them.
|
Contact:
DISCO Corporation
Corporate Strategy Division
Management Strategy Department
Marketing Communications Team
Phone: 81-3-4590-1090Fax: 81-3-4590-1094 |
|
|
|
