DISCO Corporation RECEIVES INTEL'S PRESTIGIOUS SUPPLIER CONTINUOUS QUALTIY IMPROVEMENT AWARD
TOKYO, Japan, March 21, 2006 -- DISCO Corporation, was named a recipient of Intel Corporation's prestigious 2005 Supplier Continuous Quality Improvement (SCQI) award, Intel's highest honor for its suppliers, for outstanding commitment to quality and performance by suppliers that provide products and services deemed essential to Intel's success. The company was given the award for its efforts in supplying Intel precision singulation, wafer saws, and grinding equipment. DISCO Corporation and 11 additional SCQI award winners will be honored at a celebration in Burlingame, California on March 21.
"DISCO is honored to receive this benchmark award for measurement of supplier performance. Intel expects, and we endeavor to deliver, innovation and flawless execution of technical solutions in our collaborative relationship. Although we are proud of this sixth consecutive award, we must remain nimble and responsive, as if this were our first," said Hitoshi Mizorogi, President, DISCO Corporation.
"DISCO is the world leader in cutting, grinding and polishing. DISCO's unsurpassed quality, technology and impeccable delivery record is underscored by achieving Intel's highest quality award, SCQI, for the 6th consecutive year. DISCO continues to be a strategic partner in the development and deployment of semiconductor manufacturing solutions," said Ron Rinfret, Director Assembly Capital Equipment Development, Intel Corporation.
The SCQI awards are part of Intel's Supplier Continuous Quality Improvement process, which encourages Intel's key suppliers to strive for excellence and continuous improvement. To qualify for SCQI status, suppliers must score at least 95 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and responsiveness goals. Additional information about the SCQI program is available at http://supplier.intel.com/quality.
Intel also will recognize SCQI award winners on March 21, 2006, with an advertisement in the U.S., Europe and Asian editions of the Wall Street Journal.
About DISCO
DISCO Corporation is currently the world leader in the introduction of exciting new machines, such as Laser Dicing, In-Line
Thin Wafer Grinding and Dry Polishing. DISCO Precision Saws, Grinders and Polishers are used in the processing of semiconductor/electronic
components, while DISCO's abrasive cutting and grinding wheels serve a varied global customer base. DISCO's more than 65
years of expertise is today embedded within the approximately 18,300 systems in use at over 2,100 customer sites throughout
39 countries.
DISCO's goal is, and has always been, to be the first company that customers turn to for any Kiru (Cutting),
Kezuru (Grinding), and Migaku (Polishing) need.
* Other names and brands may be claimed as the property of others.
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