New dicing blades and grinding wheels to realize productivity and process quality improvement
The complexity and sophistication of various electrical goods and home information appliances has promoted the fusion of semiconductors and electronic parts, as represented by MEMS. From this, new functional and complex materials have been developed. DISCO Corporation (Head Office: Ota-ku, Tokyo, President: Hitoshi Mizorogi) has developed and commercialized new dicing blades and grinding wheels to meet the processing needs for these new materials.
ZP07 Series
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| ZP07 Series |
DISCO has developed a new electroformed blade ZP07 series to improve the processing performance of difficult to cut materials. The ZP07 combines high cutting ability, which is specific to electroformed bonded blades, and appropriate self sharpening ability, by forming pores in the electroformed bond to make a porous structure using DISCO’s own manufacturing method.
The ZP07 realizes one-pass processing at unprecedented speed and quality, even for cutting of laminated wafers of Silicon + glass, which have been difficult to process in one pass until now. It has also received high appraisal from customers. |
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| Workpiece |
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Si 0.5 mmt + Glass 0.5 mmt |
| Feed speed |
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5 mm/sec |
| Spindle rotation |
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30000 rpm |
| Blade |
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ZP-SD2000 |
| Blade size |
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56 x 0.1 x 40 |
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VT07 Series
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| VT07 Series |
DISCO has developed a new dicing blade VT07 series using the outstanding cutting ability of a vitrified bond. The VT07 uses the vitrified bond, which has established a track record as a grinding wheel bond, to enable the manufacturing of thin dicing blades.
The VT07 can achieve excellent results with high-load processing, such as deep cutting of very hard materials like silicon nitride, which has been difficult to cut until now, by using the high-rigidity and high-cutting ability of the vitrified bond.
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| Workpiece |
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Silicon Nitride |
| Cutting depth |
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2.6mm |
| Groove width |
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0.25mm |
| Feed speed |
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2mm/s |
| Blade |
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VT07-SD400-VC100-75 |
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| High-load deep-groove processing is possible with one pass, which could only be realized previously with multi-step cutting |
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R07 Series BB100 bond
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| R07 Series BB100 bond |
DISCO has developed a resin RO7 series BB100 bond blade for cutting glass.
The BB100 is a resin bond blade for processing hard and brittle materials, such as glass, crystal and ceramics, at a high-grade. In addition to high-grade processing, the BB100 blade can achieve excellent results at a higher processing speed. |
| Cut surface of glass using BB100 |
Cut surface of glass using a current blade |
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GF01 Series BR385 bond
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| GF01 Series BR385 bond |
A BR385 bond wheel, suitable for grinding glass, has been added to the GF01 series grinding wheel.
By employing the newly developed resin bond for rough and finish grinding, it is possible to carry out high-grade grinding of fine surfaces. Also, due to its superior grinding ability, the BR385 can achieve continuous stable grinding of glass without intermediate dressing. |
| BR385 |
Current Wheel |
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Contact:
DISCO Corporation
Corporate Strategy Division
Management Strategy Department
Market Communications Team
Phone: 81-3-4590-1090 Fax: 81-3-4590-1094 |
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