Development of a new curvilinear processing technology to support miniaturization of memory cards
DISCO Corporation (Head Office Ota-ku, Tokyo, President: Hitoshi Mizorogi) has developed a “Edge Profile Grinding Technology” (patent pending) that uses a purpose-built blade and DAD6450 dicing saw for edge-profiling (curvilinear processing of the package edge) to support the miniaturization of memory cards.
Development Background
Next generation ultra-compact memory cards, which are being developed to support the miniaturization and high-functionality of mobile telephones and digital cameras, are becoming thinner and smaller based on die thinning and the unified molding of the die and package.
Currently, a processing method, based on either a laser or water jet, is being used for curvilinear processing to trim the shape of the package edges after unified molding. As a new processing method for this curvilinear process, DISCO has developed the “Edge Profile Grinding Technology” that uses a purpose-built blade to attain better quality and lower cost processing, based on DISCO’s abundant development experience in diamond blades and dicing saws. |
Process Merits
| Superior processing quality |
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Able to improve the surface condition (surface roughness) of the package edge compared to other processing methods, by using a newly developed “Edge Profile Grinding” purpose-built blade. |
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| Able to process at a lower cost compared to other methods |
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Able to attain a throughput of 3,000 units per hour and contribute to lowering CoO by using the parallel dual-spindle dicing saw DAD6450. |
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| Supports fully automatic processing from cutting to tray packing |
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Able to realize a consistent fully automatic system from cutting to cleaning, inspection and tray packing by integrating a handler machine, provided by a handler manufacture, inline with the dicer. |
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| Wide range of blades |
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Able to control the blade life and processing surface appearance using a wide range of blades and able to process according to customer’s needs. Also, able to process various shapes by using different shaped blades on the Z1-axis and Z2-axis. |
Future Plans
Test cuts for product evaluation can be arranged any time. For inquires regarding test cuts, please contact your local DISCO sales representative.
Sales will start from December 2006.
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Contact:
DISCO Corporation
Corporate Strategy Division
Management Strategy Department
Market Communications Team
Phone: 81-3-4590-1090 Fax: 81-3-4590-1094 |
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