DISCO has developed a new laser saw DFL7340/7360 using stealth dicing technology in cooperation with Hamamatsu Photonics
DISCO Corporation (Headquarters: Ota-ku, Tokyo, President: Hitoshi Mizorogi), in cooperation with Hamamatsu Photonics K.K. (Headquarters: Shizuoka prefecture, Hamamatsu city, President: Teruo Hiruma) has developed a new laser saw DFL7340 (for 200 mm wafers) and DFL7360 (for 300 mm wafers) using stealth technology developed by Hamamatsu Photonics.
Development background
In recent years, the challenges facing dicing technology have become increasingly complex
due in part to the expansion of the MEMS device market and the utilization of low-k materials in ICs. In 2002,
DISCO announced the DFL7160 laser saw, which is used for process applications such as grooving low-k wafers
and scribing sapphire substrates for LEDs. Since then, DISCO has developed various laser processing techniques
using novel optical technologies.
The newly developed DFL7340/7360 is a laser processing system that uses stealth dicing technology, developed by Hamamatsu Photonics, as a dicing solution for MEMS devices and thin wafers.
As a result of this cooperation, there are synergistic opportunities for technology and application development for both companies as well as the potential to establish further intellectual property strategies. The collaborative effort serves to expand the available processing options for end users.
What is stealth dicing?
"Stealth dicing technology" uses a fissure in the wafer in order to singulate the
wafer into die. First, a laser is focused below the surface of the wafer to create the fissure.
The wafer is then
exposed to a controlled external stress, such as tape expansion, and the wafer separates along the path of
laser irradiation.
Stealth dicing Features
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No chipping
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Kerf width is almost zero
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High throughput (in the case of thin wafers)
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Dry process
DFL7340/7360 Features
This system combines DISCO's extensive background in precision equipment and software
technology with a new SD (Stealth Dicing) engine consisting of a modularized laser and dedicated optical system
specifically developed by Hamamatsu Photonics. This collaboration results in a precise, reliable process solution.
Photograph: DFL7340
Schedule
October, 2007
Test cut requests accepted
January, 2008
Acceptance of orders
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
