Development of the new DFL7260 laser saw capable of supporting two laser heads
DISCO Corporation has developed a new laser saw, the DFL7260, that can be installed with two
laser oscillators. With the development of the DFL7260, support for various ablation(*) processes becomes possible,
such as achieving a laser full cut of ever thinner low-k wafers with one machine.
This machine will be on display at
SEMICON Japan 2007 in December.
*Ablation is a processing method that vaporizes a specific section of the workpiece by irradiating with an extremely strong laser light for a short period of time.
Development background
In recent years, the mechanical strength of the interconnection wiring has became brittle due to the miniaturization of IC die and the lower specific inductive capacity of low-k materials. In addition, to realize further miniaturization of various electronic devices, particularly mobile telephones, demand is strengthening for wafer thinning to increase the number of stacked die within one package and to also thin the package itself.
DISCO is already proposing "laser grooving with a laser saw (DFL7160) + blade dicing with a dicing saw (DFD6361)" as an application
that can cut a low-k wafer without delamination (peeling). However, it is assumed that the degree of difficulty of blade
dicing increases due to wafer thinning. Therefore, DISCO has been developing an application that considers wafer full
cutting with only a laser process.
Ablation processing needs to drastically change the laser processing condition to meet the solid state properties of the
workpiece. Since the "processing conditions to suppress delamination of the low-k film” and the "processing conditions
to cut silicon with minimal thermo stress" conflicts with the conditions of a laser oscillator, two laser saws "DFL7160" were
required to full cut a workpiece with only a laser process.
As a result, developing the DFL7260 has made the realization of this application possible with one machine.
DFL7260 Features
[Application expansion using two oscillators]
The DFL7260 broadens the range of possible applications because it can be equipped with two oscillators. For example,
if the first oscillator is used for "low-K grooving" and the second is used for "silicon cutting," it
would be possible to laser full cut 300 mm low-k wafers less than 100 µm thick with DAF (Die Attach Film)
attached. (Refer to the illustration below)
In addition, if two identical oscillators were installed, it would be
possible to significantly increase the processing speed and contribute to productivity improvement.
Surface view
Cross section view
Contributes to lower CoO (Cost of Ownership)
The DFL7260 realizes greater axis precision and a maximum feed speed of 1000 mm/sec.
This
is due to an increase in rigidity compared to existing machines and to a faster and more efficient processing
point. As a result, this dramatically improves productivity and a substantially lower CoO can be expected compared
to existing machines.
DFL7260
Schedule
December 2007
Exhibit at SEMICON Japan 2007
January 2008
Test cut acceptance start date
April 2008
Sales start date
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
