Product release of the DFD6362 Fully Automatic Dicing Saw with improved productivity for 300 mm wafers
DISCO Corporation has developed the DFD6362 Fully Automatic Dicing Saw for 300 mm wafers featuring improved productivity over the DFD6361, which already has achieved a good reputation throughout the industry.
This machine will be on display at SEMICON Japan 2007 in December.
Development Background
In recent years, the transition to large diameter wafers has been increasing. It has been forecasted that in 2008 the shipment of 300 mm wafers (based on area) will exceed 200 mm wafers. On the other hand, as well as reducing costs by adopting larger diameter wafers, demand is increasing at the fab for lower (better) CoO (Cost of Ownership) based on improved productivity and utilization of equipment. As the successor machine to the highly successful DFD6361 dicing saw, the DFD6362 helps meet the demand for lower CoO through higher productivity.
DFD6362 Features
[Productivity improvement]
Improvement in feed speed of both the X-axis and main wafer transfer arms increases throughput.
[Cleaning Capability Improvement]
The newly designed wheel cover as well as a variety of innovative accessories effectively prevents particle adhesion.
[ABC is Capable of Unmanned Operation Resulting in High Utilization]
The optional ABC (Automatic Blade Changer), which automatically detects blade breakage or life end, automatically replaces the blade and returns to processing, resulting in substantially reduced downtime.
[Usability Improvement]
Newly developed graphical interface software visually displays the condition of the machine making operation and monitoring easier.
DFD6362
Schedule
December 2007
Exhibit at SEMICON Japan 2007
June 2008
Sales start date
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
