| Development of the DP08 Series Dry Polishing Wheel for Stress Relief |
DISCO Corporation has developed a new dry polishing wheel, the DP08 Series that realizes stress relief of silicon wafers without using chemicals. This product will be on display at SEMICON Japan 2007 in December.
Development Background
| With electronic devices becoming smaller and increasing in functionality at an ever increasing rate, technology is in demand that produces thinner, stronger wafers and ICs . Presently, as wafers become thinner, various stress relief processes are being proposed to remove the mechanical damage layer caused by the backside grinding process. With concern about environmental issues gaining attention recently, DISCO has started offering a dry polishing process with lower environmental impact than the stress relief process that uses slurry. The DP08 series dry polishing wheel was developed to further advance these technologies, and enable dry polishing to be integrated with the DBG (Dicing Before Grinding) process. |
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| Photograph: DP08 Series |
Product Features
[Chemical-free stress relief]
The DP08 series is a wheel that realizes a DISCO unique stress relief dry polishing process that does not use any slurry or chemicals. In addition to having a low environmental impact by not using chemicals, it is simpler to use than the process that uses slurry, and it achieves better die strength.
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- Damage comparison (Observed with a TEM) - |
After DP08 polishing |
After #2000 grit grinding |
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[Enables integration with the DBG process]
The DP08 series can be used as a stress relief method for the DBG process in addition to wafer polishing in the conventional grinding process. By integrating dry polishing with the DBG process, which substantially lowers backside chipping in the dicing process and is effective in manufacturing die with high strength, the DP08 series realizes the manufacturing of higher quality ultra-thin die.
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Note: DBG (Dicing Before Grinding):
DBG is a process that first half-cuts the wafer and then separates the die during backside grinding. This is a reverse of the standard process where backside grinding is carried out before wafer dicing. |
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DISCO's Wafer Thinning Solution
DISCO is successfully responding to the needs of various devices and processes by providing a wide range of solutions for wafer thinning. These include stress relief using “dry polishing,” as introduced above, and “plasma etching,” fine grit grinding using the Poligrind, and ultra-fine grit grinding using the UltraPoligrind, which was also announced today.
Schedule
| December 2007 |
On display at SEMICON Japan 2007 |
| January 2008 |
Evaluation starts in the demo room |
| April 2008 |
Sales start date (planned) |
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Contact:
Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail: aosumi/att/disco/pod/co/pod/jp
Phone: 81-3-4590-1090
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