Development of the New DGP8761 300 mm Wafer Fully Automatic Grinder/Polisher, the Newly Developed E PAD Stress Relief Polishing Pad, and the New DFM2800 Fully Automatic Wafer Mounter
DISCO Corporation has developed a DGP8761-DFM2800 in-line system that further improves the productivity of the DGP8760-DFM2700, which has been well received worldwide as a wafer thinning in-line system for φ300 mm wafers. In addition, as a new stress relief technique, DISCO has developed the E Pad using polishing technology know-how to realize an environmentally superior slurry free polish. These products will be on display at SEMICON Japan 2007 in December.
Development Background
The miniaturization and high functionality of SiP (System in Package) devices, which are being used in mobile equipment such as mobile telephones, have further advanced in recent years. This has accelerated the demand for less than 50 um wafer thinning. When wafer thinning progresses, productivity decreases because the required grinding amount increases. Therefore, achieving higher productivity and lowering CoO are needed. In addition, the demand for thinning is spreading to various devices, such as logic and discrete, and the demands that are being required for these processing surfaces are also diversifying.
To accurately respond to these demands, DISCO has developed the DGP8761-DFM2800 in-line system to support ultrathin wafer grinding and realize higher productivity. DISCO has also newly developed the E Pad to realize slurry free polish.
DGP8761-DFM2800
E Pad
DGP8761 Features
[High throughput]
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The newly developed spindle supports high-speed grinding and contributes to shorter processing time. (compared to the existing machine)
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An optimized handling layout shortens the cycle time (excluding processing time)
[Various applications in response to diversifying thinning demands]
The dry polishing method, which has a large shipment base, is the standard specification for Z3-axis stress relief. With options to respond to various thinning demands, it is possible to select UltraPoligrind, which satisfies both high strength and preservation of the gettering effect, slurry free polish E Pad, and typical CMP using an abrasive cloth and slurry.
[Advanced in-line system]
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An in-line system with the newly developed mounter DFM2800 makes it possible to safely attach DAF (Die Attach Film) to thin wafers.
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A user friendly design, such as unifying the standard operations with the DGP8761 monitor.
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Able to support DBG (Dicing Before Grinding) (optional)
E Pad Features
[Quality]
The E Pad, a wet fixed abrasive polishing pad, realizes slurry free polishing with just an alkaline solution, and achieves similar processing quality as existing CMP, which uses an abrasive pad and slurry.
[Low environmental impact]
Since E Pad is slurry free, the periodic maintenance frequency for the processing chamber is less, and the environmental impact when treating slurry waste is significantly lower than existing CMP.
[Lower running costs]
In addition to lower slurry costs and maintenance man-hours, the E Pad, which has a longer product life compared to existing CMP abrasive pads, can also lower the downtime for pad replacement.
DFM2800 Features
[Supports ultrathin wafers]
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Minimizes the damage risk of thin wafers by lowering the number of wafer handling steps inside the DFM2800 by 80%, compared to the existing machine.
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Prevents wafer damage caused by particle intrusion by installing a cleaning mechanism to the handling pads and tables that contact thin wafers.
[High throughput]
By optimizing each handling unit, the maximum throughput for continuous operation realizes an approximate 50% increase, compared to the existing machine. This greatly contributes to an improvement in productivity.
[Ample options to support various needs]
Ample options are available to support customer needs, such as the robot/single load port unit to use the DFM2800 as a stand-alone machine, a precut mechanism inside the machine for dicing tape, an adhesion tape peeling mechanism for surface protection tape, and a wafer surface ID recognition mechanism (vision system) to realize barcode control after wafer mounting.
Schedule
December 2007
On display at SEMICON Japan 2007
August 2008
E Pad sales start date
August 2008
Commencement of test cuts
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
