Development of the Ultrathin Hub Blade ZHZZ Series to realize the 10 µm Kerf
DISCO Corporation has developed new dicing blade "ZHZZ Series" to respond to diverse
processing needs, following progress in miniaturization and high functionalization of electronic devices.
This products will be on displayed at SEMICON Japan 2007 in December.
Development Background
Demand is increasing to process narrow streets (street reduction), following the miniaturization of IC die and the change to larger diameter wafers in recent years. DISCO has develop a new hub blade, the ZHZZ Series, which improves the product quality of existing thin kerf (15 - 25 µm) blades, and also enables the manufacturing of thinner kerf (10 - 15 µm) blades.
Product Characteristics
The commercialization of this series, which realizes a 10 µm kerf, is based on the newly developed H1 bond and on DISCO's hub blade technology, which has been accumulated over many years. Furthermore, by manufacturing a thin kerf (15 - 25 µm) blade with this H1 bond, it substantially reduces the occurrence of slant and wavy cutting, and improves the stability of narrow street processing and high spindle RPM processing.
ZHZZ series kerf width manufacturing range
SEM photograph:
ZHZZ series(10 µm kerf)
SEM photograph:
Existing thin blade(20 µm kerf)
Schedule
December 2007
On display at SEMICON Japan 2007
January 2008
Sample orders for A/B kerf (15 - 25 µm) start
May 2008
Sample orders for Z kerf (10 - 15 µm) start
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
