Development of the TAIKO process,
a new process method for wafer backgrinding
DISCO Corporation (Headquarters: Ota-ku, Tokyo, President: Hitoshi Mizorogi) will announce the TAIKO*1 process, a new wafer backgrinding technology, at SEMICON Japan 2005, which will be held for three days from December 7.
The TAIKO process is the name for the wafer backgrinding that uses a new technology developed by DISCO. This technology is different to conventional backgrinding. When the wafer is being ground, about 2 mm of the wafer backside outer circumference is left and remains unground. Only the inner area of the wafer is ground to the required thickness. By using this technology, it has been confirmed that various merits exist, such as lowering the handling risk of thin wafers and reducing warpage.
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| Wafer cross section diagram |
TAIKO Wafer |
| "TAIKO Process" Development Background |
Recently, System in Package (SiP) technology has become established from the trend toward high-density packaging due to the miniaturization and high functionality of electronic devices. In such a situation, wafer thinning has become a necessary process technology. A development of technology has been requested to avoid as much as possible the various apparent wafer damage risks such as breakage during handling, cracking and breakage due to wafer warpage that occurs during wafer thinning. At DISCO, new technology development that is required to support customers' needs like these has led to the development of the TAIKO Process.
| Merits of the TAIKO Process |
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Merits of making an outer circumference lip |
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Lowers wafer warpage |
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Improves wafer strength |
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Wafer damage does not occur due to wafer edge chipping |
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Wafer handling improvement |
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The post-thinning processing, such as through-hole formation and bump distribution, becomes
simpler
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| Storage of 50 µm ground wafers in a regular wafer cassette (no bending occurs) |
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When a high temperature process (such as metallization) is required after wafer thinning, gas
formation does not occur
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Lower particle introduction due to integrated structure and simple shape |
Wafer hold based on hard substrate |
TAIKO Wafer |
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Merits of not putting a load on the outer circumference during grinding |
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Wafer grinding with a lip on the outer circumference is simple |
Conventional grinding process |
TAIKO process |
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| Results achieved at the present time related to "TAIKO" |
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Wafer size |
: 8-inch notched wafer, 6-inch orientation flat wafer |
| Machine |
: DAG810 |
| Grinding thickness |
: Able to grind to 20 µm (8-inch notched wafer) |
| Currently, the equipment that can perform the "TAIKO process" is the DAG810, which is a semi-automatic machine that has been favorably received by the customers. In the future, DISCO plans to develop a fully automatic machine. |
| 2005/12 |
Exhibited at SEMICON Japan 2005 from December 7 to 9. |
| 2005/12 |
Test cut requests, based on the DAG810 TAIKO specification machines will be accepted at any time. |
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| *1 Currently being registered as a Trademark |
| *2 A structure that can maintain the strength of the wafer, without using a hard substrate |
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Contact:
DISCO Corporation
Corporate Strategy Division
Management Strategy Department
Marketing Communications Team
Phone: 81-3-4590-1090Fax: 81-3-4590-1094 |
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