Automatic Cleaning System
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The spinner unit cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces. Appropriate for use with automatic dicing saws and other machines that lack a cleaning function, the unit offers cleaning with water, rinsing with user-specified chemicals (option), and drying.
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DCS141 |
DCS1440 |
DCS1460 |
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| Maximum workpiece |
ø8" |
ø8"/250mm square |
ø300mm/310mm square |
| Supported frames |
2-5, 2-6, 2-8 |
2-5, 2-5-1*, 2-6, 2-6-1, 2-8-1 |
2-5, 2-5-1*, 2-6, 2-6-1, 2-8-1, 2-12, 2-12-1 |
| Cleaning methods |
High-pressure cleaning specification |
High-pressure cleaning specification, Atomizing cleaning nozzle specification* |
Table roating speed range
(min-1) |
0 - 3,000 |
100 - 3,000 |
| Spinner discharge pressure (MPa) |
2.0 - 12.0 |
2.0 - 11.8 |
Machine dimensions (WxDxH)
(mm) |
400 x 719 x 1,220
(excludes lamp tower) |
400 x 600 x 1,220
(excludes lamp tower and touch panel) |
500 x 650 x 1,220
(excludes lamp tower and touch panel) |
| Machine weight (kg) |
About 150 (with transformer for overseas use: About 170) |
About 130 (with transformer for overseas use: About 164) |
About 150 (with transformer for overseas use: About 184) |
| Features |
Designed to complement 300 Series dicing saws, DCS141 has a small footprint and overall size and is easy to operate. |
Double-arm cleaning can be installed as an option, and the cleaning function has been improved. In addition, it was designed to be environmentally-friendly in accordance with green procurement and RoHS. |
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