Product Information

B1A Series

Precision processing of hard-to-cut materials

Sintered metal powder is used as the bonding agent material to realize strong holding power. As a result, these blades have low blade wear. These blades are ideal for high precision grooving and cutting of electronics parts or optical devices.

Features

Minimized blade wear and high cutting ability
High rigidity - minimized wavy and slant cutting
Wide range of bond types supports processing of glass and CSP
Able to control diamond concentration to achieve cutting quality

Applicable Workpieces

Electronic parts, optical devices, various types of semiconductor packages, ceramics, mono-crystal ferrite, glass, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Processing Data

Comparison of cutting efficiency for bond types

The above shows the tendency of the process result when a dresser bord is cut.
Depending on the cutting conditions and type of material, the tendency may vary.
Therefore, this shall only be used as reference.

Application by grit size

Specifications

	*1	Regarding the combination of the blades Internal code and bonding strength of each blade correspond to the bond type. Please refer to the chart below.
	*2	Varies according to the blade.
	*3	All slit widths are 0.5 mm (except for the SS type)