Product Information

R07 Series BB100

The R07 series BB100 bond realizes high grade processing of hard and brittle materials such as glass, crystal and ceramics.

The BB100 bond is a new resin bond in the R07 series that realizes a higher processing quality and was developed for the cutting of hard and brittle materials, such as glass and crystal. This new bond can improve productivity for the cutting of crystal materials by satisfying both high-grade and high-speed processing, which have been conflicting demands until now.

Features

Realizes high processing quality for the cutting of hard and brittle materials
High-speed processing of hard and brittle materials is possible

Applicable Workpieces

Glass, crystal, ceramic, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

Experimental Data

Glass cutting process
For glass processing, the R07 series BB100 bond achieves less chipping than current blades for both the front side and backside.

Crystal cutting process
Even under the condition of twice the current blade's processing speed, the BB100 bond achieves less chipping for both the front side and backside.