Product Information

Dicing Blades

DISCO's dicing blades are used with dicing and cutting saws to groove, cut, and dice silicon, compound semiconductors, glass, ceramics, crystals, and almost any other material. They are one key to DISCO's excellence in Kiru (dicing) processing.

New Products

Series	Application	Feature
R07 Series	Glass, quartz, ceramics, etc.	Resin bond hub-less blades. A wide range of blades is available to support high-grade and high-speed processing for various processing needs of hard, brittle materials.
ZHCR Series	Silicon wafer, etc.	Electroformed bond hub blades. These reduce blade tip shape collapse that easily occurs when processing with a thick blade or when there are a lot of TEG in the street. Also, these realize improved product life and processing quality.
ZP07 Series	Composite materials (Silicon + glass wafer etc), ceramics, etc.	Hubless blades with pores formed into the electroformed bond. Realizes high-grade processing of composite materials (such as glass + silicon wafers).
VT07 Series	Silicon nitride, silicon carbide, crystal, etc. ceramics, etc.	Hubless blades using vitrified bonds. Realizes processing with a high degree of dimensional accuracy and straightness with high load processes.

Series	Application	Bond type	Blade type
ZH05 Series	Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO₃, etc.), etc.	Electroplated bond	Hub (integrates an aluminum flange and the NBC-Z series)
ZHRF Series	Silicon, etc.
ZHFX Series	Oxide wafers (LiTaO₃), etc.
NBC-ZH Series	Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO₃, etc.), etc.
Z05 Series	Chip LED board, Green Ceramics, Hard and brittle material		Hubless (Washer)
NBC-Z Series	Silicon, GaAs, GaP, various types of semiconductor packages, etc.
B1A Series	Electronic parts, optical devices, various types of semiconductor packages, ceramics, mono-crystal ferrite, glass, etc.	Metal bond
P1A Series	Glass, crystal, quartz, lithium tantalate, various types of semiconductor packages, ceramics, etc.	Resin bond
A1A/K1A Series	A1A: Ceramics, various types of glass, Ferrite, etc.	Metal bond	Steel core
A1A/K1A Series	K1A: Various types of glass, crystal materials, compound materials,etc.	Resin bond	Steel core