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Product Information

R07 Series

The R07 series realizes high-grade processing of hard, brittle materials, such as glass, quartz and ceramics. It also has a wide range of bonds to support various needs.

A new bond material was developed for the resin bond blade R07 series to match the characteristics of the material that will be processed. With the newly develop bond range, it is possible to satisfy both high-grade and high-speed processing.

Features

High processing quality for cutting of hard, brittle materials
High-speed processing of hard, brittle materials is possible

Bond comparison

Applicable Workpieces

glass, quartz, ceramics, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

Experimental Data

Borosilicate glass cutting process (BB101 bond)
Achieves smaller chipping than the existing blade for both the front and backside, and longer blade life.

Quartz cutting process (BB200 bond)
Achieves smaller chipping than the existing blade for both the front and backside, and longer blade life.

Alumina ceramic cutting process (BB300 bond)
The chipping is about the same for both the front and backside as the existing blade, however it achieves longer blade life.