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| DISCO HOME > Product Information > Dicing Blades > VT07 Series |
The VT07 series can handle various materials from processing of hard-to-cut workpieces to edge trimming of silicon wafers
Features
Applicable Machines
Specifications
Compared to the existing blade, the VT07 blade can achieve a higher grade of processing for sapphire, which has an extremely high hardness.
The current blade bends during deep-groove processing. The VT07 series (VC100 bond) can achieve highly straight processing results for deep-groove.
The wafer edge trimmed by the VT07 blade (VC200 bond) has the same quality realized by the resin blade processing.
Cautions during usage Note the below points on its characteristics when using the vitrified bond.
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