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Product Information

Z05 Series

The Z05 Series offers ultra-high cutting performance for a wide range of workpieces and applications.

The Z05 Series electro-formed bond blades employ new DISCO advances in materials and manufacturing process. The result is two types of ultra-high-performance blades that handle anything from hard and brittle materials to BGA, resin circuit boards, and tough device packages.

Applicable Workpieces

Chip LED board, Green Ceramics, Hard and brittle material

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

Features

Up to 5 concentration levels provide a greater blade selection.
In processing hard and brittle materials, process quality is improved while blade life is maintained.

"Grit concentration" refers to the percentage of diamond grit in the abrasive portion of the blade. For example, a grit concentration level of 100 indicates 25% diamond grit by volume. During dicing, grit concentration affects both the speed of blade wear and the size of chipping. By selecting precisely a grit concentration that is appropriate to the application, both wear speed and process quality can be made more stable and consistent.

Blade edge retains shape for stable and consistent processing.
Burring of metal and plastic may be prevented or reduced.

< Cutting example >
Burring (through-hole)
Preventing lateral wear at the blade edge can result in stabilized process quality and increased blade life.