Product Information

ZHFX Series

The ZHFX Series realizes high level continuous processing of oxide wafers by using a new bond.

	The ZHFX Series employs a bond that has ideal wear properties for processing newly developed oxide wafers. It is capable of continuously processing oxide wafers, which has been difficult thus far, with a high level with stability. In addition, greater processing stability can be expected in the DBG processing of Lithium Tantalite wafers.
	Hub blade handling safety sheet

Features

Realizes high level and stable processing of oxide wafers
Significantly lowers dress frequency during processing and shows high continuous processing performance.

Lithum Tantalite wafers process example


New ZHFX Series	Current NBC-ZH Series

Applications

Oxide wafer(LiTaO3, etc), etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

Experimental Data

The ZHFX Series is an optimal blade for applications such as half-cut dicing for the DBG process or hte continuous rocessing of oxide wafers.

Topside chipping size comparison

Wafer	:	4" LiTaO_{3 x 350µmt}
Depth	:	350µm (full cut)
Blade	:	ZHFX-SD2000-C1-50 DF NBC-ZH105L 27HEDF

Spindle current comparison

The left graph shows the measurement of current during the processing of a LiTaO₃ wafer. With the ZHFX Series, compared to the existing series, as the number of lines increased, there is no rise in current, so stable processing can be verified.