Product Information

ZHRF Series

The ZHRF Series provides stable quality even in high load processing, due to improved blade strength.

By employing new technologies, the blade strength is further improved compared to previous hub-blades. The ZHRF minimizes blade slant cutting even under high load conditions such as for high speed processing, thick wafer cutting or wafers that have a lot metal on the streets. It also achieves a stable processing result.In addition, by combining a ZHRF blade with laser grooving for the processing of low dielectric constant (Low-k) layer wafers, backside chipping and peeling are eliminated and high speed processing is possible.

Hub blade handling safety sheet

Features

Shows stable processing performance in high load processing.
Realizes high speed wafer cutting after laser grooving.

Blade Strength comparison

Compared to the previous series, the ZHRF Series is seen to have improved strength.

Applications

Silicon wafers, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

Experimental Data

The ZHRF Series, compared to the previous blade series, controls slant cutting even in high load processing and makes stable processing possible, due to the improved blade strength.

Slant cut amount comparison

- Measurement point -

Wafer	:	Si + Cu layer 2µm
Depth	:	200µm (half cut)
Speed	:	150mm/s

Photo of a groove

New

Current

Lowers the occurrence of wavy cut
The ZHRF Series controls wavy cuts under a condition of high load and high rotation, and it also controls slant cutting. This makes stable processing possible.