DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR Careers
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Product Information > Dicing Blades > ZHRF Series

Product Information


ZHRF Series

ZHRF Series Catalog
The ZHRF Series provides stable quality even in high load processing, due to improved blade strength.
By employing new technologies, the blade strength is further improved compared to previous hub-blades. The ZHRF minimizes blade slant cutting even under high load conditions such as for high speed processing, thick wafer cutting or wafers that have a lot metal on the streets. It also achieves a stable processing result.In addition, by combining a ZHRF blade with laser grooving for the processing of low dielectric constant (Low-k) layer wafers, backside chipping and peeling are eliminated and high speed processing is possible.
  Hub blade handling safety sheet

Features
  • Shows stable processing performance in high load processing.
  • Realizes high speed wafer cutting after laser grooving.
Blade Strength comparison
Compared to the previous series, the ZHRF Series is seen to have improved strength.
Applications
Silicon wafers, etc.

Applicable Machines
6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

Experimental Data
The ZHRF Series, compared to the previous blade series, controls slant cutting even in high load processing and makes stable processing possible, due to the improved blade strength.

Slant cut amount comparison
- Measurement point -
Wafer : Si + Cu layer 2µm
Depth : 200µm (half cut)
Speed : 150mm/s
Photo of a groove

New

Current
Lowers the occurrence of wavy cut
The ZHRF Series controls wavy cuts under a condition of high load and high rotation, and it also controls slant cutting. This makes stable processing possible.

New

Current
*This evaluation was conducted under conditions which intentionally tend to cause wavy cut.
Wafer : Si
Depth : 400µm (half cut)
Speed : 80mm/s
Spindle rpm : 55000mm/s
Product Information
Precision Machines
 
 
Precision Processing Tools
 
 
Other Products
 
 

Trade Show Information

Personal Information Protection Policy
User Agreement
Contact
Copyright 2001-2009 DISCO Corporation All rights reserved.
Back To Top