DISCO HOME > Product Information > Dicing and Cutting Saws

Products Information

Fully Automatic Dicing Saw

Fully automatic dicing saw

Fully Automatic Dicing Saw 6000 Series

Facing dual-spindle dicing saw

	Max. Workpiece size	Spindle		Application
		Layout	Output
DFD6240	8"	Single	1.2KW (0.19N·m) 1.8 kW(0.29 N·m) 2.2kW (0.70 N·m)	Silicon, various types of glass, substrates for semiconductor packages, optical devices
DFD6340		Facing dual
DFD6450		Parallel dual	1.0 kW (0.16 N·m) 1.0 kW torque up (0.24 N·m) 2.2 kW air (0.70 N·m) 2.2 kW mechanical (1.05 N·m)
DFD6361	300 mm	Facing dual	1.2 kW (0.19 N·m) 1.8 kW (0.29 N·m) 2.2 kW (0.70 N·m)
DFD6362

*1.0 kW higher torque, 1.8 kW and 2.2 kW spindles are optional specification.

Fully Automatic Dicing Saw 600 Series

Parallel dual-spindle dicing saw

	Max. Workpiece size	Spindle		Application
		Layout	Output
DFD641	8"	Single	1.0 kW (0.16 N·m)	Silicon, Compound semiconductor wafers, various types of glass
DFD651		Parallel dual
DFD660	300 mm	Single
DFD670		Parallel dual
DFD681	8"	Single	2.2 kW (0.70 N·m)
DFD691		Parallel dual

Automatic Dicing Saw

Automatic dicing saw

Automatic Dicing Saw 3000 Series

	Max. Workpiece Size	Spindle		Application
		Layout	Output
DAD3220	6" (6" square)	Single	1.5 kW (0.48 N·m)	Silicon, various types of glass, substrates for semiconductor packages, optical devices
DAD3230	6" square 8" x 6" (option)
DAD3430
DAD3350	8" 250 mm square		1.8 kW (0.29 N·m) 2.2 kW (0.70 N·m)

*2.2 kW spindles are optional specification.

Automatic Dicing Saw 300 Series

	Max. Workpiece size	Spindle		Application
		Layout	Output
DAD321	160 x 160 mm	Single	1.5 kW (0.48 N·m)	Silicon, Compound semiconductor wafers, various types of glass
DAD322	ø6" (6"square)*
DAC351	153 x 153 mm
DAD361	160 x 160 mm
DAD381	304.8 x 304.8 mm		1.0 kW (0.16 N·m)

(*)A special jig is required for this function.

Automatic Dicing Saw 500 Series

	Max. Workpiece size	Spindle		Application
		Layout	Output
DAD522	8"	Single	1.5 kW (0.48 N·m)	DAD:Silicon, Compound semiconductor wafers, Thick/Hard substrates DAC:magnetic heads
DAC552	220 x 160 mm		1.0 kW (0.16 N·m)
DAD562	8"		1.5 kW (0.48 N·m)

Automatic Dicing Saw 600 Series

	Max. Workpiece size	Spindle		Application
		Layout	Output
DAD685	250 x 250 mm	Single	1.0 kW (0.24 N·m) 2.2 kW (1.0 N·m)	Package Singulation
DAD685		Parallel dual

*2.2 kW spindles are optional specification.

Accessory Equipment	Details

Products for New Processes	Details

Precision Machines

Dicing and Cutting Saws

Specification Comparison Chart

Polishers and Dry Etchers

Products for New Processes

Precision Processing Tools

Grinding Wheels

Dry Polishing Wheels

Other Products

Accessory Equipment

Related Products

Catalog Downloads

Personal Information Protection Policy

Copyright 2001-2008 DISCO Corporation All rights reserved.