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DISCO HOME > Product Information > Grinding Wheels > GF01 Series BT100/BT300

Product Information

GF01 Series BT100/BT300

 GF01 Series BT100/BT300 Catalog
BT100/BT300, a newly developed resin bond for rough grinding wheels, offers ultra-high grinding quality.
Grinding Wheel GF01 Series Adopting the newly developed resin bond enables reducing edge chipping and grinding damage which are problems in thin wafer grinding. The BT100 bond emphasizing quality and the BT300 bond emphasizing wheel life are available to offer a selection suitable for various needs.

Features
  • Newly developed resin bond offers ultra-high grinding quality.
  • New wheel base (GF01) offers highly effective delivery of coolant water.
  • The BT100 emphasizing quality and the BT300 emphasizing wheel life are available.

Wheel comparison

Applicable Workpieces
Silicon wafer, etc.

Applicable Machines
DAG800 Series, DFG800 Series and DFG8000 Series grinders DGP8000 Series polishers

Specifications

Comparative Data with Previous Wheels
The BT100/BT300 bond causes less edge chipping, compared with the existing vitrified bond.

Edge chipping

Workpiece : ø8" sillicon mirror wafer x 3
Final thickness : 100 µm
Z2 removal amount : 35 µm
Z2 wheel : IF-01-1-4/6-B-K09

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