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GS08 Series

 GS08 Series Catalog
Porous vitrified bond, fixed abrasive wheels resulting in high quality grinding of SiC wafers
GS08シリーズ GS08 series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes.

Features
  • Grinding with a fixed abrasive results in a surface roughness approaching a polish
  • Grinding can be performed on tape-mounted wafers for easy operation
  • Non-slurry process for a low environmental impact
Porous vitrified bond
The GS08 series employs an original porous vitrified bond.
Applicable Workpieces
SiC, Al2O3, Si3N4, etc.
Applicable Machines
DAG800 Series, DFG800 Series and DFG8000 Series grinders
DFP8000 Series polishers

Specifications
Experimental Data

Surface roughness when grinding SiC

Wheel
used		 SE0126
(Standard)		 SA0135
(Fine mesh)
Ra(µm) 0.011 0.001
Ry(µm) 0.115 0.009
 
Workpiece : ø3" SiC wafer
Measurement system : Contact high-resolution surface profile measurement system
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