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Grinding Wheels

DISCO's grinding wheels grind silicon, compound semiconductors, crystals, and a wide variety of other materials. They are an essential part of DISCO's excellent Kezuru (Grinding) solutions.

New Products
Series Application Feature
GF01 Series BR385 GF01
Series
BR385
Borosilicate glass, non-alkali glass, crystal,various glass types, etc. Grinding wheels using resin bonds. Realizes stable continuous grinding without the need of interim dressing, and making possible the high-grade grinding of glass.

  Series Application Feature
IF Series Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. Standard grinding wheels with extensive record of success
GF01
Series
New wheel series featuring advanced coolant water delivery
GF01
Series
BT100
By employing the newly developed resin bond, it realizes lower edge chipping and grinding damage, and is the optimum 1-axis bond for thin grinding.
Poligrind Silicon wafers, etc. Poligrind offers a new dimension in ultra-high-quality grinding.
RS Series* Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. Purpose-built wheel for creep-feed grinding method.
* The DFG-83H/6 is no longer sold, however the supply of the RS Series continues.

Please refer the Material Safety Data Sheet (MSDS) pages about Dicing Blades, Grinding Wheels, Dresser Boards.
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