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DISCO HOME > Product Information > Fully Automatic Laser saw

Product Information

7000 Series - Fully Automatic Laser saw -
Laser Saw
The 7000 Series Laser Saw performs loading, alignment, laser processing (Full cutting, grooving and inner-modifying process), cleaning, drying and unloading with just the touch of a button. In addition, the LCD touch panel with dicer-based graphical user interface makes operation easy to master.
Laser processing method introduction  
Ablation processing
　compliant products1 , compliant products2
Process method where solids can be vaporized or sublimated by focusing laser energy on a extremely small area for a short time.
<Ablation processing Applications>
DBG + DAF Laser Cut
Laser Full Cut Dicing
Low-k Grooving
Stealth dicing
　compliant products
This is a dicing method that forms a modified layer in the workpiece, by focusing a laser inside the workpiece, and then implements die separation with a machine such as a tape expander.
<Stealth dicing Application>
Stealth Dicing Application
φ300mm wafer ablation process φ6"wafer ablation process Stealth dicing process
  DFL7340
DFL7340 Catalog		 DFL7360
DFL7360 Catalog
DFL7340 DFL7360
Models 8-inch frame compliant stealth dicing laser saw ø300 mm wafer compliant stealth dicing laser saw
Max. Workpiece Size (mm) ø8" ø300 mm
Max. Applicable
tape frame size		 2 - 8 - 1 Frames not supported
X-axis
(Chuck table)		 Processing range (mm) 210 310
Max. processing speed (mm/s) 1,000
Y-axis
(Chuck table)		 Processing range (mm) 210 310
Index step (mm) 0.0001
Index positioning accuracy 0.003/310
(Single error) 0.002/5
Scale resolution (mm) 0.0001
Z-axis Input range for lens height (mm) -2,000 to 5,000
Moving resolution (mm) 0.0001
Repeatability accuracy (mm) 0.001
θ-axis
(Chuck table) 		Max. rotating angle (deg.) 380
(320° in the positive (+) direction and 60° in the nagative (-) direction from the initial position)		 380
(245° in the positive (+) direction and 135° in the negative (-) direction from the initial position)
Laser Oscillator Oscillator Model Semicondutor laser diode (LD) excitation Q-switch solid laser
Machine dimensions
(W x D x H) (mm)		 1,000 x 1,800 x 1,990 1,700 x 2,950 x 1,800
Machine weight (kg) Approx. 1,960
(without transformer)
Approx. 2,040
(with transformer)		 3,000
(for reference)
*

DFL7360
A chiller unit is placed outside the machine.
*

The above specifications may change due to technical modifications. Please confirm when placing your order.
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