Product Information


Fully Automatic Multifunction Wafer Mounter

DFM2700 and DFM2800 offers DAF (die attach film) lamination*, UV irradiation, protective tape peeling, and dicing frame mounting-all in one compact unit. DFM2700 and DFM2800 are also in-line-compatible with 8000 Series machines for 300 mm: DFG8560, DFP8160, DGP8760, and DGP8761.
*

DAF with integrated dicing tape is supported by the DFM2700 and DFM2800. DAF by itself is only supported by the DFM2700.

DFM2700
DFM2700 Catalog
DFM2800
DFM2800 Catalog
DFM2700 (DGP8760) DFM2800 (DGP8761)
Power Power Input Single phase AC200-230 V ±10 % 50/60 Hz
Power consumption(kW) 10 10 (for reference)
Power capacity(kVA) 12 10
Air Supply Pressure(MPa) 0.5 to 0.8
Pressure variability(MPa) 0.03 or less
Flow(L/min) 500 or higher 500 or higher (for reference)
Vacuum Pressure(KPa) -80 or higher
Flow(L/min) 175 300 or higher (for reference)
Ducts Main body
Displacement(m3/min) 0.4 or higher 4 or higher
Static pressure(kPa) 0.04 or higher 0.04 or higher (for reference)
UV unit
Displacement(m3/min) 2.7 to 5.1 2.7 to 5.1 or higher (for reference)
Static pressure(kPa) 0.27 to 0.51 0.6 or higher
DAF Post-cure section
Displacement(m3/min) 4 or higher -
Static pressure(kPa) 0.4 or higher -
Machine dimensions
(W x D x H) (mm)
2,200 x 3,700 x 1,800 2,150 x 2,600 x 1,800
Machine weight (kg) Approx. 2,900 Approx. 2,600
*

The above specifications may change due to technical modifications. Please confirm when placing your order.

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