Product Information


Fully Automatic Polisher 8000 Series

Polisher
The 8000 Series polishers perform loading, polishing, cleaning and drying, and unloading with just the touch of a button. They are also in-line-compatible with DISCO 8000 Series grinders and a variety of tape machines for greater efficiency and wafer handling safety. The proprietary dry polishing process, which requires no chemicals, slurry, or water, employs a special non-diamond grit to impart a mirror finish to silicon and other semiconductor materials for excellent stress relief.

In-feed grinding
Grinder/Polisher Polishers Dry Etcher
  DFP8140
DFP8140/8160 catalog
DFP8160
DFP8160 Catalog
DFP8140
DFP8160
Wafer Diameter ø 4" - ø 200 mm
(ø 4" - ø 8")
ø 200 mm - ø 300 mm
(ø 8" - ø 12")
Polishing Method Anomalous In-feed grinding with wafer rotation
Spindle Type Air bearing with high frequency motor
Number of axes

1

Output (kW) 4.8 7.5
Revolution speed (min-1[rpm]) 1,000 - 4,000 1,000 - 3,000
Z-axis vertical stroke (mm) 100 (with zero point) 72 (with zero point)
Z-axis vertical grinding feed speed (mm/s) 0.0001 - 0.08
Z-axis vertical fast feed speed (mm/s) 50
Min. Z-axis vertical movement (µm) 0.1
Min. Z-axis vertical movement resolution オm 0.1 (µm) 0.1
Wafer Chuck Table Chuck table type Porous chuck table
Chuck method Vacuum
Number of revolutions (min-1[rpm]) 0 - 300
Number of chuck tables 1
Chuck table cleaning Backflushing of water and compressed air is combined with oilstone cleaning and brush cleaning
Wafer cleaning Washing using an atomizing nozzle
Internal load sensor Thin force sensor
Spark Out (chuck table revolutions setting) 0 - 999
Y-axis processing stroke (mm) 420 510
Y-axis max.speed (mm/s) 0.5 - 200
Y-axis min. resolution (mm) 0.002
Dry Polishing Wheel ø 300 ø 450
Wafer Handling Section / Wafer Cleaning Section Cassette storage quantity 2
Cassette flow Same flow and open flow
Spinner unit Water washing by atomizing nozzle and drying
Vacuum Unit Discharge speed (m3/h) 29/36 50/60 (Hz)
Achievable pressure (kPa) -90
(water supply temperature 15 °C, water supply flow rate 1L/min)
Electric motor (kW) 1.5
Water flow rate (L/min) When supplied water temperature is greater than 22 °C : 3
When supplied water temperature is less than 22 °C : 1
Dust Collector System Wet cyclone system
Cylinder volume (m3/min) 4.0
Motor (kW) 1.0
Water used (L/min) 4.0
Processing Accuracy Variation in removal amount (µm) ±1 or less (when removing 2 オm in average)
Machine dimensions
(W x D x H) (mm)
1,200 x 2,670 x 1,800 1,400 x 3,322 x 1,800
Machine weight (kg) Approx. 1,900 Approx. 2,400
*

The above specifications may change due to technical modifications. Please confirm when placing your order.



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