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Applications Expertise in Kiru (cutting), Kezuru (grinding), Migaku (polishing)
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 We believe that what our customers really want is not just the products that DISCO supplies but the processing results derived from using our products as a means to an end. Based on this idea, we provide the processing know-how (application technology) related to Kiru (cutting), Kezuru (grinding) and Migaku (polishing) accumulated over a long period of time as the best processing results through free-of-charge processing tests (test cuts).
The test cut support reinforces the trusting relationships with our customers and at the same time brings out further advanced expertise to draw on, including the process leading to these results. Such accumulation of know-how is what sustains our response toward highly-advance inquires from our customers. |
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Applications R&D Labs Around the Globe |
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 The DISCO Head Office Applications R&D Laboratory, respected throughout the industry, features 35 machines, over 3,000 different diamond products, and 50 highly skilled applications engineers. This large and central lab handles test requests from around the world, while local facilities in Japan (Sendai, Osaka, and Kumamoto) and the US, Germany, Singapore, and China let customers participate in research at locations convenient to them.
Customers use DISCO's applications facilities in a variety of ways. Some ship their wafers or other workpieces, letting DISCO investigate and select the optimum machines, abrasive tools, and processing conditions for the job. Many customers, however, take advantage of DISCO's open doors and visit the labs themselves, working closely with DISCO's engineers to create new processes and solutions.
In fact, many manufacturers consult DISCO Applications R&D at the design stage of a new product. DISCO's engineers are eager to participate in such research, as DISCO seeks always to be the first point of contact for any Kiru, Kezuru, Migaku need. |
This introduces the equipment that will be used for test cuts at the Applications Labs of DISCO worldwide affiliate offices. It is also possible to do test cuts with machines that are not shown here. And at the DISCO Corporation (Tokyo), DISCO HI-TEC SINGAPORE (Singapore) and DISCO HI-TEC EUROPE (Munich), test cuts with some equipment can be conducted in a clean room. For details, please contact your DISCO sales representative.
| Machine Models Used in Applications Support |
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Laser Saw |
Dicing Saws |
Grinders |
Polishers |
DISCO Corporation
(Tokyo) |
DFL7160 (Grooving and Full-cut) |
DAD3220, DAD3230, DAD3430, DAD3350, DAD3350 Ultrasonic ver. , DFD6240, DFD6340, DFD6361, DFD6450 |
DAG810, DFG8540, DFG8560, DFG8540 DBG ver. |
DFP8140,
DGP8760+DFM2700 |
DISCO HI-TEC AMERICA
(Santa Clara) |
DFL7160 (Full-cut) |
DAD3220, DAD3350, DFD6240, DFD6361 |
DAG810, DFG8540 |
DFP8140, DGP8760+DFM2700 |
DISCO HI-TEC SINGAPORE
(Singapore) |
DFL7160 (Grooving and Full-cut） |
DAD3350, DFD6340, DFD6361 |
DAG810 (Taiko and Package Grinding) |
DGP8760+DFM2700 |
DISCO TECHNOLOGY
(SHANGHAI) |
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DAD3350, DFD6340 |
DFG8540 |
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DISCO HI-TEC EUROPE
(Munich) |
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DAD3350, DFD6340, DFD6360 |
DFG8540+DFE8040,
DAG810 (Possible for TAIKO Process) |
DFP8140, DGP8760 |
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