| December 7, 2007 |
Dicing Saw |
 |
LTCC Dicing |
| November 27, 2007 |
Precision Processing Tools |
|
Development of the Ultrathin Hub Blade ZHZZ Series to realize the 10 µm Kerf |
|
Precision Processing Tools |
|
Development of the ZHCR Series Reduces Tip Shape Collapse of Thick Blades |
|
Precision Processing Tools |
|
Development of the GS08 Series Realizes High-Quality Grinding of SiC |
| November 20, 2007 |
Others |
|
Development of the New DGP8761 300 mm Wafer Fully Automatic Grinder/Polisher, the Newly Developed E PAD Stress Relief Polishing Pad, and the New DFM2800 Fully Automatic Wafer Mounter |
| |
Others |
|
Development of the DDS2300 Fully Automatic Die Separator to Precisely Separate DAF |
| November 6, 2007 |
Precision Processing Tools |
|
Development
of a New Wafer Thinning Solution, the "UltraPoligrind" Wheel |
| |
Precision Processing Tools |
|
Development
of the DP08 Series Dry Polishing Wheel for Stress Relief |
| October 30, 2007 |
Dicing Saw |
|
Product
release of the DFD6362 Fully Automatic Dicing Saw with improved productivity for 300 mm wafers |
| October 23, 2007 |
Laser Saw |
|
Development
of the new DFL7260 laser saw capable of supporting two laser heads |
| October 22, 2007 |
Grinder |
|
Wheel Shape for Wafer Thinning |
| October 15, 2007 |
Laser Saw |
|
DISCO has developed a new laser saw DFL7340/7360 using stealth dicing technology in cooperation with Hamamatsu Photonics |
| August 13, 2007 |
Dicing Saw |
|
EAD6750, A New, Automatic Dicing Engine for Package Singulation has been added. |
| July 6, 2007 |
Dicing Saw |
|
Lithium
Tantalite (LT) Dicing |
| July 5, 2007 |
Grinder |
|
Merits
of TAIKO grinding |
| |
Dicing Saw |
|
Introduction
to StayCool (Cutting liquid for QFN package cutting) |
| May 16, 2007 |
Others |
|
워터제트쏘 장비(Water Jet Saw)에 의한 절단 |
| May 7, 2007 |
Laser Saw |
|
DBG + DAF레이저 커팅 |
| April 20, 2007 |
Others |
|
"Discontinued
Machines List" has been updated. |
| April 13, 2007 |
Dicing Saw |
|
New
conditions and chips for conditioning |
| April 4, 2007 |
Grinder |
|
씬 웨이퍼 마무리 연삭(Finishing) |
| |
Laser Saw |
|
레이저 풀 커팅 다이싱 |
| March 26, 2007 |
DBG |
|
Die
chipping countermeasure for the DBG process |
| |
Dicing Saw |
|
Profile
processing using a dicer -2 |
| |
Dicing Saw |
|
Wafer
edge chipping countermeasure |
| March 1, 2007 |
Grinder |
|
Glass
Grinding |
| |
Dicing Saw |
|
Effectiveness
of Step Cut and Bevel Cut |
| January 31, 2007 |
DBG |
|
DBG
Processing of Wafer level-CSP (Patent Pending) |
| |
Dicing Saw |
|
Kerf
Check Function |
