This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
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| Wafer Thinning |
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DISCO exhibits variety of solutions for wafer thinning, such as DBG(Dicing Before Grinding), Grinding Wheels, Stress relief(Dry Polish) and DAF cutting process. |
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| Laser Technology |
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DISCO will exhibit a wide range of laser applications(stealth dicing, grooving, full cut, etc) with actual processed samples. |
| Precision Machines |
Fully Automatic Die Separator
DDS2300
Automatic Dicing Saw
DAD322
Automatic Cleaning System
DCS1460
*Panel only
Automatic Dicing Engine
EAD6750
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| Precision Processing Tools |
| Dicing Blades |
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・ZHZZ series
(Ultrathin hub blades that realize 10 µm kerf)
・ZHCR series
(An expanded lineup of resin bond blades for cutting hard, brittle materials)
・Other blades
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| Dry Polishing Wheel |
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・DP08
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| Contact |
Your comments and questions are welcome.
Please click here to contact us.
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