| LED process solutions |
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DISCO will introduce a new process which reduces the processing steps for sapphire substrates. |
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| Laser Technology |
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We will exhibit a wide range of developed laser applications (stealth dicing, grooving, full cut, etc) with actual processed samples. |
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| TSV |
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We will introduce advanced Kiru・Kezuru・Migaku technologies for TSV with actual processed samples. |
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| Precision Processing Tools |
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| Contact |
Your comments and questions are welcome.
Please click here to contact us.
For more information, please refer to the SEMICON Taiwan 2010 Website.
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