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DISCO HOME > Product Information > Dry Polishing Wheels > DP08 Series

Product Information

DP08 Series

 DP08 Series Catalog
In addition to wafer polishing in the conventional grinding process, the DP08 realizes chemical-free stress relief that can even be used with the DBG process.
DP08シリーズ The DP08 series enables polishing of ultra-thin wafers with DISCO's unique dry polishing process. In addition to having a low environmental impact by not using chemicals, it achieves high die strength and is simple to operate compared to a process that uses slurry.

Damage comparison (Observed with a TEM)
Damage has been removed from the wafer processed with dry polishing.

After DP08 polishing
After #2000 grinding
Applicable Workpieces
Silicon wafers, etc.
Applicable Machines
DGP8000 Series Grinder/Polisher
DFP8000 Series polishers

Specifications
Experimental Data

Die Strength (Ball point breakage test)

Workpiece ： 8" Silicon wafer
Final grinding thickness ： 200µm

Surface roughness

DP08 Series Grinding Wheel (#2000)
Ra(µm) 0.0003 0.0146
Ry(µm) 0.0017 0.0814
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