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DISCO HOME > Product Information > DFS8910,DAS8920/8930　- Fully Automatic Surface Planer -

Product Information

DFS8910,DAS8920/8930
- Fully Automatic Surface Planer -
Surface Planer
The DFS8910 and DAS8920/8930 lowers connection defects by planarizing Au bumps on LCD drives and makes the bumps dimpleless.
From loading a wafer, washing it after processing and up through unloading it back into the cassette, all wafer handling is automatic. Furthermore, the DFS8910 supports processing of resin and ductile metals (gold, copper, and aluminum), and attains high-level planarization.
Introducing processing example
Cutting and Planarization Using a Surface Planer
DFS8910
DFS8910 Catalog		 DAS8920
DAS8920 Catalog		 DAS8930
DAS8930 Catalog
DFS8910 DAS8920 DAS8930
Wafer Diameter Max ø 8" * Max ø 300mm
Number of spindles 1
Number of chuck tables 1
Transport/Cleaning With Without
Process Precision Bump height variation within the wafer (µm) Less than 2.0 Less than 3.0
Bump height variation within the die (µm) Less than 1.0
Bump roughness surface (µm) Rz less than 0.1
Machine dimensions
(W x D x H) (mm)		 1,200 x 2,670 x 1,800 500 x 1,250 x 1,780 730 x 1,700 x 1,780
Machine weight (kg) Approx. 1,900 Approx. 800 Approx. 1,500
*

For customers who would like to process workpieces greater than Φ8" in diameter, please contact your local DISCO sales representative.
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