Product Information

UltraPoligrind

Use of super-fine diamond abrasive achieves high die strength while maintaining gettering performance, and offers new solutions for wafer thinning.

UltraPoligrind employs a super-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind. This new finish grinding wheel is also able to maintain a gettering effect, which is often removed when a stress relief process is used. It is a chemical-free normal grinding process resulting in a low environmental impact, and allows wafer thinning grinding with ease of operation.

Features

High die strength with little damage to wafers
Maintains the same gettering performance as normal grinding

TEM comparison of wafer damage
The damaged layer of a wafer ground using UltraPoligrind is extremely small compared to that of a wafer ground using a #2000 grinding wheel.

UltraPoligrind Wheel

#2000 Wheel

Applicable Workpieces

Silicon Wafers, etc.

Applicable Machines

DAG800 Series, DFG800 Series and DFG8000 Series grinders
DFP8000 Series polishers

Specifications

Experimental Data

Die strength comparison

Assistance with Using Poligrind
To achieve the best processing results possible with Poligrind, correct formulation of the application is required. DISCO's applications engineers will be happy to work with your workpiece and specifications to achieve the desired processing results.

Gettering effects
The amount of Cu precipitated onto the polished surface of a mirror wafer sample after applying a copper solution is 1.0E11 and more. In contrast, the amount of Cu precipitated onto the polished surface of an UltraPoligrind sample is the detection limit or less, thus indicating that the UltraPoligrind surface provides gettering.

TXRF measurement data before and after Cu solution application (φ8" mirror wafer)
		To quantitatively measure the gettering effects, a sample was contaminated with a Cu solution and then the Cu was diffused in at 350°C for 3 hours and then analyzed using TXRF (Total-Reflection X-ray Fluorescence). For the UltraPoligrind sample, the Cu solution was applied to the ground surface. The Cu was then diffused in at the same time and temperature, and the amount of Cu precipitated onto the polished surface was measured using TXRF.
	* Detectable range at below 0.5E10 atoms/cm²