The newly developed GF01 Series in-feed grinding wheels feature a special aluminum base unique to DISCO. This base delivers grinding water even more efficiently than that of the IF series, resulting in highly consistent processing and optimized wheel life.
Features
Special wheel base delivers grinding water in a highly efficient manner
Bond selection is identical to that of IF Series, making transition easy
Series offers highly precise grinding results and exceptionally consistent grinding performance
Uses packaging made with environmentally-friendly PP or ABS resin
Rough grinding
Handles a variety of materials, including oxide and nitride layers, and realizes consistent processing results.
VS
: Standard bond
BT300
: Bond realizing both good processing quality and long life
BT100
: For Ultra-thin grinding
Fine grinding
Specially-formulated resin bonds allow for reduced depth of damage and highly dependable grinding
quality.Designed for improved TTV and surface roughness, GF01 Series fine-grinding wheels combine high processing quality
with optimized wheel life.
BK01
: For enhanced grinding performance
BK02
: For reduced wheel wear
BK04
: Standard bond
BK09
: For high-load grinding
Applicable Workpieces
Silicon wafers, Compound semiconductor wafers, Crystal materials for electronics components, etc.
Applicable Machines
DAG800 Series, DFG800 Series and DFG8000 Series grinders
DFP8000 Series polishers
Specification
Standard wheel types
Bond selection will vary by application; please contact your DISCO representative for assistance.