DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Headquarters: Ota-ku, Tokyo; President: Kazuma Sekiya), has completed construction of a new seismically isolated building (Zone D, Building A) at Kuwabata Plant (Kure City, Hiroshima). With the new building added onto the existing building (Zones A, B, C), the total floor space is approximately 1.3 times greater than before.
In addition, with the completion of Zone D, Building A, expansion has been concluded, having been conducted over three phrases since the completion of Zone A in January 2010, in anticipation of greater future semiconductor and electrical components demand.
As a result, a stronger business continuity system and more stable product supply have been realized as measures in preparation for emergency situations.
The semiconductor and electronic components markets are expected to continue to expand in the mid-to-long term with the further spread of AI, IoT, and 5G as the next-generation communication standard, the development of self-driving technologies, and changes in lifestyle due to the worldwide spread of COVID-19. Demand for DISCO’s precision processing equipment*1 and tools*2 by device manufacturers, semiconductor manufacturing contractors, electronic components manufacturers, etc. has been increasing accordingly. For these reasons, it was necessary to further strengthen our product supply system. In addition, an even stronger business continuity system was needed that could withstand disasters such as earthquakes and climate change brought on by global warming.
Production floors in the existing building (Zones A to C, Building A) are currently operating at almost full capacity. With the completion of Zone D, the total floor space of Kuwabata Plant is approximately 1.3 greater than before, and we are planning to expand production, mainly for precision processing tools, with this new space. In addition, automated facilities to improve production efficiency will be further developed.
Based on our experience in responding to water outages caused by heavy rain in western Japan in July 2018, we made it possible to stockpile industrial water and water for daily use in Zone D. Water tanks filled with industrial water for use in production have been installed underground in Zone D, making it possible to store approximately 1,000 tons of water. Even when water supply is cut off, this amount of water will allow the production of precision processing tools to continue for about 10 days.
In addition, a total of about 560 tons of water for daily use, such as for sewage, etc., is stored in each section of Zone D. Even in an emergency, this amount of water is sufficient for about 10 days of use by employees living in the dormitory on the upper floor of the plant, employees engaging in disaster recovery, and employees who need to temporarily evacuate themselves and their families. Plans have also been made to install water tanks filled with water for daily use in the existing buildings.
Furthermore, drilling for groundwater is currently underway at Kuwabata Plant and Kure Plant in Hiroshima Works.
Along with this, in-house production of water quality regulation facilities that apply pure water circulation system technology is currently in development, and we are working to secure the water resources necessary for business continuity and maintaining the daily lives of employees engaged in production.
As in the existing buildings, a seismically isolated structure has been adopted for Zone D as a measure against earthquake damage.
Along with the establishment of this production system, DISCO will be recruiting new employees. In order to ensure a smooth start for the newly recruited employees, a dormitory for single employees is being constructed on the upper floor of Zone D (Dormitory opening: tentatively August 2021).
|Name||Zone D, Building A at Kuwabata Plant, Hiroshima Works, DISCO Corporation|
|Structure||8 stories / seismically isolated structure|
|Total floor space||Approx. 67,795.97 m2 (current Zones A to C: 194,436.72 m2)|
|Total investment||Approx. JPY 14 billion|
|Construction start||September 2, 2019|
|Construction completion||August 6, 2021|
|Operation start||August 2021|
|March 1989||Current land acquired|
|December 1989||Began operations at Kuwabata Plant. Later, 13 buildings constructed|
|September 2007||Decision to construct Zone A, Building A, Kuwabata Plant. Constructed by consolidating the existing low-rise, space-inefficient buildings.
The purpose was to strengthen BCM with the adoption of a seismic structure and to prepare for future demand by expanding production space vertically.
|September 2008||Started construction on Zone A, Building A|
|January 2010||Completed construction of Zone A, Building A|
|January 2015||Completed construction of Zone B, Building A|
|January 2019||Completed construction of Zone C, Building A|
|August 2021||With completion of Zone D in Building A, expansion completed at Building A. Total floor space of Building A: 262,232.69 m2
Compared to the previous structures (2008) before Zone A construction, floor space expanded by approx. 5 times. Total investment in Building A construction: approx. JPY 49.8 billion.
*1 Precision processing equipment: machines for cutting, grinding, or polishing silicon wafers, etc.
*2 Precision processing tools: tools mounted in precision processing equipment for cutting or grinding, which are frequently replaced consumables.
*3 BCM: Business Continuity Management
Decision for Further Expansion of Kuwabata Plant in Order to Enhance Production System of Precision Processing Tools (October 25, 2017)
Completion of New Building Construction at Nagano Works Chino Plant (January 6, 2021)
About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.