Event Schedule

SEMICON Southeast Asia 2023

The highlights

  • Machines: DFD6755, DIS100
  • Consumable (Hub Blade, Hubless Blade, Wheel)
  • KKM for Packaging Process
  • SiC Solution
  • Laser Processing
  • Wafer Thinning Processing
SEMICON KOREA

The highlights

  • Machines: DFD6363
  • SiC Solution
  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
  • Laser Processing
  • Power Device Processing
  • Narrow Street Solution (SDBG, DBG etc)
NEPCON JAPAN

The highlights

  • Electronic Component Processing
  • Advanced Package Processing
  • Power Device Processing
  • Laser Processing
  • Wafer Thinning Processing

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