Event Schedule

China International Import Expo

The highlights

  • Laser Processing
  • Power Device Processing
  • Precision Processing Tools
IC China

The highlights

  • Machine: DIS100, DWR1720
  • Wafer Thinning
  • Laser Processing
  • Power Device Processing
  • Electronic Component Processing
SEMICON JAPAN Virtual

The highlights

  • Machine: DFG8020, DFG8030, DIS100, MUSUBI, DFD6363, DDS2320
  • Precision processing tools: Dicing blades, Grinding wheels, Dry polishing wheels
NEPCON Japan
-Participation cancelled-
  • Date: January 20-22, 2021
  • DISCO has decided to cancel participation in the next INTERNEPCON Japan to be held at Tokyo Big Sight (January 20–22, 2021) in consideration of the health of both customers and employees during the COVID-19 pandemic.

Recommendation