Event Schedule

SEMICON Europa 2021 (co-located with productronica)

The highlights

  • Machines: DAD3650, DAG810, DWR1722, Semi-automatic wafer mounter
  • KABRA
  • SiC dicing and grinding
  • Ultra thinning and dicing solution for bump wafers and MEMS wafers
  • Laser dicing
  • Plasma dicing
European Conference on Silicon Carbide and Related Materials (ECSCRM 2020·2021)

The highlights

  • KABRA
  • SiC dicing and grinding
  • Technical presentation on SiC processing
IC China

The highlights

  • Machine: DIS100, DWR1722
  • Electronic Component Processing
  • Laser Processing
  • SiC processing
  • Wafer Thinning
SEMICON Southeast Asia 2021

The highlights

  • Machine: DFD6363 DBG ABC, MUSUBI, DWR1722, DIS100, Unitray, DFG8020, DFG8030
  • Precision Processing Tools(Hub Blades, Hubless Blades, Wheels)
  • KKM-Link
SEMICON China 2021

The highlights

  • Machine: DAD3221, DAD3350, DFD6363, DFG8640, DFL7161, DIS100, DWR1722
  • Wafer Thinning
  • Laser Processing
  • Power Device Processing
  • Electronic Component Processing
NEPCON Japan
  • Date: January 20-22, 2021

The highlights

  • DISCO has decided to cancel participation in the next INTERNEPCON Japan to be held at Tokyo Big Sight (January 20–22, 2021) in consideration of the health of both customers and employees during the COVID-19 pandemic.

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