Event Schedule
- SEMICON Taiwan 2022
- Date: September 11-16, 2022
- Venue: TaiNEX 1, Taipei
- Official website: https://www.semicontaiwan.org/en
The highlights
- Machine: DFD6363, DWR1722, DIS100
- Narrow Street Solution (MUSUBI, SDBG, DBG etc)
- Laser Processing
- SiC Solution
- SECS/GEM
- Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
- ICSCRM 2022
- Date: September 14-16, 2022
- Venue: Congress Centre in Davos, Switzerland
- Official website: https://icscrm2022.org/
The highlights
- SiC Total Solution
- SEMICON West HYBRID
- Date: July 12–14, 2022
- Venue: Moscone Center, San Francisco, CA USA
- Official website: https://www.semiconwest.org/
The highlights
- Machine: DAD3221
- Laser Processing
- SiC Solution
- Wafer Thinning Processing
- Power Device Processing
- SEMICON Southeast Asia 2022
- Date: June 21–23, 2022
- Venue: Setia SPICE Arena & Convention Centre, Malaysia
- Official website: https://www.semiconsea.org/
The highlights
- Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
- KKM for Packaging Process
- Laser Processing
- Wafer Thinning Processing
- SiC Solution
- Laser World of Photonics
- Date: April 26-29, 2022
- Venue: Messe Munich, Germany
- Official website: https://world-of-photonics.com/en/
The highlights
- KABRA
- LLO
- LEAF
- SD
- Laser grooving and Plasma dicing
- SiC Solution
- Consultation for KKM Service
- SEMICON Korea 2022
- Date: February 9-11, 2022
- Venue: COEX, Hall A, B, C, D, Seoul
- Official website: https://www.semiconkorea.org/en
The highlights
- Machine: DWR1722
- Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
- Narrow Street Solution (MUSUBI, SDBG, DBG etc)
- Laser Processing（Ablation , Stealth dicing）
- Advanced Package Processing
- SiC Solution