Event Schedule
- China International Import Expo
- Date: November 5-10
- Venue: National Exhibition and Convention Center (China)
- Official website: https://www.ciie.org/zbh/index.html
The highlights
- Laser Processing
- Power Device Processing
- Precision Processing Tools
- IC China
- Date: October 14-16
- Venue: Shanghai New International Expo Centre (China)
- Official website: http://www.ic-china.com.cn/Index.asp
The highlights
- Machine: DIS100, DWR1720
- Wafer Thinning
- Laser Processing
- Power Device Processing
- Electronic Component Processing
- SEMICON JAPAN Virtual
- Date: December 14-17
- Venue: Online
- Official website: https://www.semiconjapan.org/en
The highlights
- Machine: DFG8020, DFG8030, DIS100, MUSUBI, DFD6363, DDS2320
- Precision processing tools: Dicing blades, Grinding wheels, Dry polishing wheels
- NEPCON Japan
-Participation cancelled- - Date: January 20-22, 2021
- DISCO has decided to cancel participation in the next INTERNEPCON Japan to be held at Tokyo Big Sight (January 20–22, 2021) in consideration of the health of both customers and employees during the COVID-19 pandemic.