Event Schedule
- SEMICON Europa 2021 (co-located with productronica)
- Date: November 16-19, 2021
- Venue: MESSE MÜNCHEN
- Official website: https://www.semiconeuropa.org/
The highlights
- Machines: DAD3650, DAG810, DWR1722, Semi-automatic wafer mounter
- KABRA
- SiC dicing and grinding
- Ultra thinning and dicing solution for bump wafers and MEMS wafers
- Laser dicing
- Plasma dicing
- European Conference on Silicon Carbide and Related Materials (ECSCRM 2020·2021)
- Date: October 24-28, 2021
- Venue: Vinci International Convention Centre
- Official website: https://www.ecscrm-2020.com/
The highlights
- KABRA
- SiC dicing and grinding
- Technical presentation on SiC processing
- IC China
- Date: September 27-29, 2021
- Venue: Shanghai New International Expo Centre(China)
- Official website: http://www.ic-china.com.cn/Index.asp
The highlights
- Machine: DIS100, DWR1722
- Electronic Component Processing
- Laser Processing
- SiC processing
- Wafer Thinning
- SEMICON Southeast Asia 2021
- Date: August 23-27, 2021
- Venue: Virtual Exhibition
- Official website: https://www.semiconsea.org/
The highlights
- Machine: DFD6363 DBG ABC, MUSUBI, DWR1722, DIS100, Unitray, DFG8020, DFG8030
- Precision Processing Tools（Hub Blades, Hubless Blades, Wheels）
- KKM-Link
- SEMICON China 2021
- Date: March 17-19, 2021
- Venue: Shanghai New International Expo Centre(China)
- Official website: https://www.semiconchina.org/
The highlights
- Machine: DAD3221, DAD3350, DFD6363, DFG8640, DFL7161, DIS100, DWR1722
- Wafer Thinning
- Laser Processing
- Power Device Processing
- Electronic Component Processing
- NEPCON Japan
- Date: January 20-22, 2021
The highlights
- DISCO has decided to cancel participation in the next INTERNEPCON Japan to be held at Tokyo Big Sight (January 20–22, 2021) in consideration of the health of both customers and employees during the COVID-19 pandemic.