Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.
Introduction to DISCO solutions that help customers tackle issues concerning Kiru・Kezuru・Migaku processes, including technical know-how, test cuts, and processing services.
Introduction to DISCO customer support, including support systems, product improvement information, and troubleshooting.
DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently.
Dicing Thin Wafers
In recent years, with the increased adoption of IC cards, RFID tags, and SIP (system in package) for cellular phones and other mobile products, the market for finished semiconductor die 50 µm thick or less has grown rapidly. This high demand has in turn made the processing of thin wafers an essential competence for many device manufacturers. To provide the processing results that these companies require, DISCO continuously researches and develops the machines, blades, and applications that make thin wafer dicing a reality.
Debris and Particle Removal
CCD and CMOS image sensors, now quite common in digital cameras and mobile phones, are extremely sensitive to particles. Further, the adhesion of debris to IC bonding pads can result in bonding failure. DISCO handles potentially harmful particles and debris with a variety of machine features and applications.
QFN Package Processing
In the past, the processing of QFN (Quad Flat No-Lead) packages was performed with routers and other machine tools, but now that smaller and more varied packages are common, the use of a dicing saw has become more and more popular. DISCO's dicing saws can offer higher singulation throughput and productivity as well as less copper burring, while DISCO's new resinoid blade for package singulation can significantly improve process quality.