Acquisition of Accreditation for Dimensional Calibration in Accordance with International Standard ISO/IEC17025:2017
DISCO CORPORATION (Headquarters: Ota-ku, Tokyo; President: Kazuma Sekiya), a semiconductor processing equipment manufacturer, underwent an assessment at the Kuwabata Laboratory, a newly established laboratory within the Kuwabata Plant, Hiroshima Works, and was accredited as being a calibration laboratory in compliance with ISO/IEC17025:2017, which sets out general requirements for testing and calibration laboratories.
Accreditation Range
Accreditation No.:130301 Initial Accreditation Date: May 15, 2025
1. Non-contact clip-on thickness measuring device using spectral-interference displacement meter by SLD light source and block gauge
2. Thickness standard strip for calibration using spectral-interference non-contact clip-on thickness measuring devise by SLD light source (hereinafter “thickness standard strip for calibration”)
The ISO/IEC17025:2017 certification was acquired through an assessment performed by PJLA*1, an accreditation body, for the above calibration details. With this accreditation, DISCO will be able to issue calibration certificates with the ILAC*2 MRA*3 mark and the accreditation body mark as an accredited calibration business, and these certificates will be accepted in countries and regions who are part of the ILAC.
*1 PJLA: Perry Johnson Laboratory Accreditation Inc.
*2 ILAC: International Laboratory Accreditation Cooperation
*3 MRA: Mutual Recognition Arrangement
Products Subject to Accreditation Range
The thickness standard strip for calibration is installed with GI@dMETRO®*4, a wafer thickness measurement tool that is used on DGP8762 or DMG8762 for the cluster system MUSUBI®.
*4 Can be installed on equipment as an optional specification
DGP8762
Cluster system MUSUBI®
Background of Acquiring the ISO/IEC17025:2017 Accreditation
In recent years, with the increasing demand for high density, high capacity semiconductors, wafer thinning is necessary in order to laminate more die. Therefore, it is becoming more important to measure and manage the thickness of thinned wafers.
In order to measure and manage the thickness of wafers after thinning at DISCO, it was necessary to achieve traceable calibration in line with national standards, and DISCO has been developing the technology for the thickness standard strip for calibration and building a management system.
DISCO believes that acquiring the ISO/IEC17025:2017 accreditation will contribute to the manufacturing of high-quality products through the provision of highly reliable calibration results to our customers.
*MUSUBI® and dMETRO® are registered trademarks of DISCO CORPORATION in Japan and other countries.
About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.
Contact
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